Unlock instant, AI-driven research and patent intelligence for your innovation.

Multi-chip packaging structure applied to power conversion devices and packaging frame array

A multi-chip packaging and power conversion technology, which is applied in the direction of circuits, electrical components, and electric solid devices, can solve the problems of reducing the volume of power conversion devices, difficult to meet safety distances and heat dissipation, and reducing the cost of power conversion devices. Effect of heat dissipation, improvement of integration, and flexible selection

Pending Publication Date: 2019-10-01
SHANGHAI BRIGHT POWER SEMICONDUCTOR CO LTD
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the limitations of the traditional package frame structure, the further improvement of the package module integration level of small and medium power power conversion devices makes it difficult to meet the requirements of safety sp

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-chip packaging structure applied to power conversion devices and packaging frame array
  • Multi-chip packaging structure applied to power conversion devices and packaging frame array
  • Multi-chip packaging structure applied to power conversion devices and packaging frame array

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] figure 1 is a schematic diagram of a multi-chip packaging structure in Embodiment 1 of the present invention, figure 2 It is a structural schematic diagram of the packaging frame of the multi-chip packaging structure in Embodiment 1 of the present invention. combine figure 1 and figure 2 As shown, the multi-chip packaging structure includes: a packaging frame 100 and a first chip 210 , a second chip 220 and a third chip 230 packaged on the packaging frame 100 .

[0073] specific reference figure 2 As shown, the packaging frame 100 includes a plurality of base islands and a plurality of pins. Wherein, the plurality of pins are arranged on both sides of the base island. Wherein, the plurality of pins include a first type pin P1 and a second type pin P2, and the first type pin P1 is contact-connected to the base island (that is, the first type pin P1 is connected to The base islands are directly connected), and each base island may be provided with the first type ...

Embodiment 2

[0113] The diode in the first embodiment is based on the anode substrate, and the difference from the first embodiment is that the diode in this embodiment is based on the cathode substrate. The following is attached image 3 , the encapsulation structure in this embodiment will be described in detail.

[0114] image 3 It is a schematic diagram of the multi-chip packaging structure in Embodiment 2 of the present invention, such as image 3 As shown, the cathode of the diode in the third chip 230 is attached to the third base island 130 through conductive glue (for example, negative glue or solder paste, etc.), so as to be electrically connected to the third base island 130 , at this time, it can be considered that the third pin P13 directly connected to the third base island 130 constitutes a cathode pin. It should be recognized that during the working process of the diode on the third base island 130 , the cathode of the diode will generate a lot of heat, which can be dis...

Embodiment 3

[0123] In the packaging structure provided by the above embodiments, the boundaries of the whole formed by the first base island, the second base island and the third base island are aligned. The difference from the above embodiment is that in this embodiment, the end of the third base island away from the drain pin can be protruded relative to the second base island; or, the second base island can also be made to correspond to the drain pin. One end of the pole pin protrudes relative to the first base island; or, it is a combination of the above two situations, so that the first base island, the second base island and the third base island are dislocated.

[0124] Figure 4 It is a schematic diagram of the multi-chip packaging structure in Embodiment 3 of the present invention, specifically refer to Figure 4 As shown, in this embodiment, the end of the third base island 130 away from the drain pin (ie, the second pin P12 ) protrudes relative to the second base island 120 . ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a multi-chip packaging structure applied to power conversion devices and a packaging frame array. In the multi-chip packaging structure, a first base island, a second base island and a third base island are arranged on a packaging frame, and a first chip with a driving module formed thereon, a second chip with a power tube device formed thereon and a third chip with a diodeformed thereon are respectively arranged on the different base islands. Thus, the integration degree of the packaging structure is improved on the basis of ensuring the heat dissipation effect. Whether a diode with a cathode substrate or a diode with an anode substrate is adopted, the anode of the diode can be connected to the drain pin of the second base island. Therefore, the application flexibility of the diode is improved, the limitation of the diode type is avoided, and the preparation cost can be saved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a multi-chip packaging structure applied to a power conversion device, and a packaging frame array applied to the multi-chip packaging structure. Background technique [0002] At present, with the development of integrated circuit production technology, more and more high-voltage devices tend to be integrated. This feature is particularly evident in power conversion devices. In traditional power conversion devices, the peripheral circuits are originally implemented by discrete devices, and more and more peripheral devices can be integrated into IC chips with the development of integrated circuit technology. Under this development trend, the volume of power conversion device products is getting smaller and smaller. While the product volume is reduced, the cost is also reduced. [0003] Common modules contained in a power conversion device include a rectifier...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/31H01L23/49
CPCH01L23/49H01L23/3114H01L2224/49113H01L2224/48247H01L2224/0603H01L2224/48137
Inventor 胡黎强周占荣李阳德陈家旺张辉
Owner SHANGHAI BRIGHT POWER SEMICONDUCTOR CO LTD