electrical products
一种电气产品、电子电路的技术,应用在衬底积层体领域,能够解决费用、劳力、时间增加等问题
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[0026] Below, while referring to the appendix Figure 1 An embodiment of the electrical product of the present invention will be described.
[0027] like Figure 1 to Figure 4 As shown, the electrical product of the present embodiment includes a substrate laminate 8, four (four-layer) electronic circuit substrates (hereinafter, abbreviated as "substrates") 1- i (i=1, 2, 3, 4) build-up; a stage (mounting part) 7 for mounting on the back surface of the substrate 1-1 of the lowermost layer (first layer); and a case (not shown), The substrate laminate 8 and the mounting table 7 are accommodated inside.
[0028] In addition, the lowermost layer of the substrate 1-i mounted on the stage 7 is referred to as the first layer 1-1 (i=1), and the uppermost layer is referred to as the second layer 1-2 (i=2), and the third layer in this order. Layer 1-3 (i=3), 4th layer 1-4 (i=4). In addition, the substrate 1-i may be simply collectively referred to as the substrate 1 in some cases. In...
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