Chip taut manual pick-up device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- QINGDAO AEROSPACE SEMICON RES INST
- Publication Date
- 2021-05-11
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Abstract
Description
technical field
[0001] The invention relates to a device and a method for manually picking up chips under tension. Background technique
[0002] At present, manual chip picking is mainly to manually use tweezers, vacuum pen or other tools to clamp a very small single chip out of a densely arranged chip array. During the operation, the chip is stuck on a special mucous membrane, which can be passed through The method is degumming to reduce the adhesive force. Although the degumming is performed, the chip is still tightly attached to the film without gaps. It is difficult to pick up the chip with tweezers or other tools, which is easy to cause scratches, edge chipping, and missing corners. In order to reduce the above defects, the current operation methods are as follows: 1. Destroy the peripheral edge chip of the chip ring, and then use tweezers to pick up the chip from the damaged place, but the disadvantages of this operation are as follows: 1. Waste the edge chip; 2. If t...