Chip taut manual pick-up device

A chip and stretch frame technology is applied in the field of chip tensioning and manual picking devices, which can solve the problems of poor separation of chips and membranes, waste of edge chips, missing corners and raised tooling, etc., so as to reduce chip damage costs and solve the The effect of waste and improved yield
CN110335846BActive Publication Date: 2021-05-11QINGDAO AEROSPACE SEMICON RES INST

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
QINGDAO AEROSPACE SEMICON RES INST
Publication Date
2021-05-11

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Abstract

The present invention relates to a device and method for manually picking up chips under tension, which includes a device for manually picking up chips under tension, including a lower base plate, a lower base plate support I, a lower base plate support II, a lever, a lever frame, a lever adjustment nut, and a lever adjustment Bolt, upper fixing plate pillar, upper fixing plate, adjustable compression block, height adjustment bar, lower frame bottom plate, right-handed bracket I, left-handed bracket I, tensioning shaft I, shaft support bracket I, shaft support bracket II, right Rotary bracket I, left-handed bracket I, tensioning shaft II, shaft support bracket III, shaft support bracket IV, oven lamp, oven lamp fixing plate, tension shaft nut I, tension shaft nut II, screw shaft, and height-limiting screw ; The present invention is reasonable in design, compact in structure and easy to use.
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Description

technical field

[0001] The invention relates to a device and a method for manually picking up chips under tension. Background technique

[0002] At present, manual chip picking is mainly to manually use tweezers, vacuum pen or other tools to clamp a very small single chip out of a densely arranged chip array. During the operation, the chip is stuck on a special mucous membrane, which can be passed through The method is degumming to reduce the adhesive force. Although the degumming is performed, the chip is still tightly attached to the film without gaps. It is difficult to pick up the chip with tweezers or other tools, which is easy to cause scratches, edge chipping, and missing corners. In order to reduce the above defects, the current operation methods are as follows: 1. Destroy the peripheral edge chip of the chip ring, and then use tweezers to pick up the chip from the damaged place, but the disadvantages of this operation are as follows: 1. Waste the edge chip; 2. If t...

Claims

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