Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

CSP LED with round light-emitting surface and processing method of CSP LED

A processing method and technology of light-emitting surface, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of mass production of CSPLED, etc., and achieve the effect of novel and unique processing method, convenient light distribution, and good visual effect.

Pending Publication Date: 2019-10-18
昆山芯乐光光电科技有限公司
View PDF2 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with the square light-emitting surface, the circular light-emitting surface has better visual effect and is more convenient for light distribution. Therefore, the CSP LED with a circular light-emitting surface has great market value. Due to the difference in the internal structure of the LED caused by the shape of the light-emitting surface, the above-mentioned package cannot be used. CSP LEDs with a circular light-emitting surface can be mass-produced by the technology, and this technical gap needs to be filled urgently

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • CSP LED with round light-emitting surface and processing method of CSP LED
  • CSP LED with round light-emitting surface and processing method of CSP LED
  • CSP LED with round light-emitting surface and processing method of CSP LED

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] Below in conjunction with specific embodiment, content of the present invention is described in further detail:

[0022] combine figure 1 with figure 2 , this embodiment is a CSP LED with a circular light-emitting surface, including a fluorescent film 1 and an LED chip 2 that are separated and fixed up and down, the fluorescent film 1 is circular, and the lower wall of the LED chip 2 is provided with a pair of electrodes 3, An adhesive layer 4 is sandwiched between the LED chip 2 and the fluorescent film 1, the upper wall of the LED chip 2 covers the lower wall of the fluorescent film 1, and white wall glue 5 is wrapped around the LED chip 2 and the fluorescent film 1, forming a whole A rectangular parallelepiped with the plane where the upper wall of the fluorescent film 1 is located as the top surface and the plane where the lower wall of the LED chip 2 is located as the bottom surface.

[0023] This embodiment is a CSP LED that emits light from one side, and its l...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a CSP LED with a round light-emitting surface and a processing method of the CSP LED. An LED chip is positioned by a carrier film, and single fluorescent films are placed on the LED chip and are pasted and fixed one by one. Different from a package process of a CSP LED having a square and downwards-facing light-emitting surface in the prior art, mass and automation mass ofthe CSP LED with the round light-emitting surface is achieved by a package method allowing the light-emitting surface to face upwards; compared with the CSP LED with the square light-emitting surface,the CSP LED with the round light-emitting surface is good in visual effect, and grading is convenient; the technical blank of the CSP LED with the round light-emitting surface is filled up, the product is good in optical effect, wide in application range, novel and unique in processing method, high in production efficiency and high in yield and has great industrial value and economic value, and the CSP LED with the round light-emitting surface is suitable for the CSP LED and the package process thereof.

Description

technical field [0001] The invention relates to the field of CSP LED and packaging technology thereof, in particular to a CSP LED with a circular light-emitting surface and a processing method thereof. Background technique [0002] LED, also known as light-emitting diode, is a semiconductor device that can convert electrical energy into visible light. Compared with the advantages, it has achieved rapid development. The application field involves mobile phones, lamps, household appliances and other daily household appliances and machinery production. Among them, CSP packaging technology is mainly used to package light-emitting components. The full name of CSP is Chip Scale Package, which refers to a fully functional packaged device whose package size is no more than 1.2 times the chip size. Therefore, LEDs packaged with CSP have small size, high current and high reliability. [0003] The light-emitting surface of CSP LEDs in the prior art is mostly square, and the packaging ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/54H01L33/00
CPCH01L33/50H01L33/505H01L33/54H01L33/005H01L33/0095
Inventor 王智勇李文海
Owner 昆山芯乐光光电科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com