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Method and device for determining parameters of 3D mold debugging

A technology for debugging parameters and determining methods, which is applied in the direction of measuring devices, optical devices, image data processing, etc., can solve the problems of insufficient staff, long training period, low efficiency, etc., and achieve the effect of improving processing efficiency

Active Publication Date: 2021-03-19
国家超级计算天津中心
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Relying on manual experience to identify defects and then debug parameters is inefficient. On the one hand, relying on manual experience requires training staff with identification and testing experience. The training period is long. When there are many detection and identification tasks, there will be insufficient staff. , which further leads to low efficiency. On the other hand, the speed and efficiency of manual identification and debugging parameters cannot be compared with the speed and efficiency of computer identification

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  • Method and device for determining parameters of 3D mold debugging

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Embodiment Construction

[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is some embodiments of the present invention, but not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. The method provided by the embodiment of the present invention can provide effici...

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Abstract

The present invention provides a method and device for determining debugging parameters of a three-dimensional mold. The method includes: acquiring a photographed image corresponding to a target three-dimensional mold; inputting the photographed image into a three-dimensional mold defect detection model, and obtaining the output value of the three-dimensional mold defect detection model Defect information, the three-dimensional mold defect detection model is obtained by using the first sample image training, the first sample image contains the first defect labeling information, the shooting information of the first sample image and the captured image Similarly, the shooting information includes the installation position and lens angle of the shooting device; according to the shooting image and the intrinsic correlation model, the debugging parameter information corresponding to the defect information is determined. The embodiment of the present invention improves the processing efficiency.

Description

technical field [0001] The invention relates to the technical field of supercomputing, in particular to a method and device for determining parameters of three-dimensional mold debugging. Background technique [0002] The method of using three-dimensional molds to produce and process product parts is widely used in industrial production. Taking automobile panels as an example, they are processed by stamping and other methods using automobile panel molds. [0003] In order to obtain qualified product components, it is first necessary to design and manufacture a three-dimensional mold. The quality of the three-dimensional mold will directly affect the quality of the product parts. For example, if there are design or processing defects on the surface of the three-dimensional mold, it will directly lead to many problems such as rough surface and surface deformation of the product parts processed by the mold. [0004] Therefore, in the process of designing and manufacturing 3D ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/00G06F30/20G01N21/88G01B11/00
CPCG06T7/0004G01N21/88G01B11/00G06T2207/20081G06F30/20
Inventor 孟祥飞李健增段莉莉彭修乾张婷
Owner 国家超级计算天津中心