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Heat dissipation structure and electronic device applying same

A technology of heat dissipation structure and electronic device, which is applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating transformation, etc., which can solve the problems of affecting the normal operation of the chip, burns, and safety risks, so as to improve the service life and avoid burns , Use the effect of high safety factor

Inactive Publication Date: 2019-10-22
NANNING FUGUI PRECISION IND CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] However, since the heat dissipated by the chip is mainly conducted through the heat dissipation holes, the temperature of the casing near the heat dissipation holes exceeds the safe temperature. When people (especially children) or animals touch or touch the casing near the heat dissipation holes, they may be burned. There are safety risks; when the electronic product is not working, the heat dissipation hole is always open, and external pollutants, such as dust, mosquitoes, etc., can easily enter the interior of the electronic product through the heat dissipation hole, affecting the normal operation of the chip

Method used

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  • Heat dissipation structure and electronic device applying same
  • Heat dissipation structure and electronic device applying same
  • Heat dissipation structure and electronic device applying same

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Embodiment Construction

[0034] figure 1 Shown is a schematic diagram of an exploded structure of an electronic device 200 using the heat dissipation structure 100 according to an embodiment of the present invention. exist figure 1 Among them, the heat dissipation structure 100 includes a first heat dissipation element 110, a second heat dissipation element 120, an elastic element 130 and a locking element 140. The second heat dissipation element 120 is movably connected to the first heat dissipation element 110 through the elastic element 130 and the locking element 140. The cooperation of the component 130 , the locking component 140 and the first heat sink 110 limits the range of movement of the second heat sink 120 . Optionally, the elastic member 130 is a spring, and the locking member 140 is a screw.

[0035] Specifically, the first heat sink 110 includes a first body 111 , a first heat sink 112 and two guide posts 113 . Wherein, the first body 111 is in the shape of a thin plate, and a plura...

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Abstract

The present invention provides a heat dissipation structure. The heat dissipation structure comprises: a first radiating piece comprising a first body and a first radiating portion arranged on the first body; and a second radiating piece comprising a second body and a second radiating portion arranged on the second body, wherein the second body is movably connected with the first body. The presentinvention further provides an electronic device. The electronic device comprises a shell; a circuit board arranged in the shell and provided with a control module; a magnetic piece fixed at the circuit board and electrically connected with the control module; and the heat dissipation structure mentioned above installed at the shell, wherein when the control module performs power-on or power failure for the magnetic piece, the magnetic piece attracts the second body to allow the second body to block or to expose the first radiating portion. The heat dissipation structure and the electronic device applying the heat dissipation structure intelligently control the on-off of the first radiating portion to avoid accidental scalding due to touch, and an application safety factor is high; and moreover, the pollutants are reduced, and the service life is prolonged.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation structure and an electronic device using the heat dissipation structure. Background technique [0002] For electronic products, circuit boards are generally mounted in closed enclosures. There are many kinds of chips integrated on the circuit board. When the chip is working, the chip emits a lot of heat. Since the shell of the electronic product is closed, the heat emitted by the chip will cause the internal temperature of the shell to rise sharply, and the high temperature environment will affect the life of the chip. and performance. Therefore, for the normal operation of the chip, it is necessary to open a large number of heat dissipation holes on the casing to conduct the heat emitted by the chip through the heat dissipation holes. [0003] However, since the heat dissipated by the chip is mainly conducted through the heat...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 唐晓虎
Owner NANNING FUGUI PRECISION IND CO LTD
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