Heat superconducting plate and heat superconducting radiator

Abstract

The invention provides a heat superconducting plate and a heat superconducting radiator. The heat superconducting plate comprises a plurality of mutually independent closed cavities, first bumps, second bumps, first liquid phase equilibrium communicating holes, second liquid phase equilibrium communicating holes, first gas phase equilibrium communicating holes and second gas phase equilibrium communicating holes, wherein each closed cavity is internally provided with a heat superconducting heat transfer channel, and the heat superconducting heat transfer channel is filled with a heat transfermedium; the first bump is located at one end of each closed cavity; the second bump is located at the end, which is away from the first bump, of each closed cavity; the first liquid phase equilibriumcommunicating hole is located at the end provided with the first bump of the closed cavity; the second liquid phase equilibrium communicating hole is located at the end provided with the first bump ofthe closed cavity; the first gas phase equilibrium communicating hole is located at the end provided with the second bump of the closed cavity; and the second gas phase equilibrium communicating holeis located at the end provided with the second bump of the closed cavity. According to the invention, the normal heat dissipation of other heat superconducting channels is not affected if one heat superconducting channel of the heat superconducting plate has a problem of heat transfer medium leakage, so that the heat dissipation performance of the heat superconducting plate can be ensured, and the reliability of the heat superconducting plate is improved.

Description

technical field [0001] The invention belongs to the technical field of heat transfer, in particular to a thermal superconducting plate and a thermal superconducting radiator. Background technique [0002] With the rapid development of power electronics technology, the integration of power components is getting higher and higher, the power density is also increasing, and the heat generated by itself during work is also increasing. The removal of heat will cause the temperature of the chip in the power device to rise, which will cause a decrease in performance and shorten the service life, and will cause the failure of the power device and the burning of the chip; an efficient and reliable heat sink is to ensure the reliability of these power devices. important part of running. [0003] Existing plate-fin radiators are generally stacked and brazed with thermal superconducting plates to form a plate-fin heat sink, and then welded to the processed substrate by argon arc welding...

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a thermal superconducting plate and a thermal superconducting heat sink, which are used to solve the defects such as poor sealing in one of the plate-fin heat sinks in the prior art. , the heat transfer medium in all the thermal superconducting plates in the entire plate-fin radiator will leak completely, making the plate-fin radiator invalid, resulting in the problem that the equipment cannot work normally, and it is necessary to use argon arc welding to stack the thermal superconducting plates The problem that the plate-fin heat sink formed by brazing is welded together with the processed substrate

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