Full-automatic laser marking machine for double-station substrate

Abstract

The invention relates to the technical field of laser marking equipment, in particular to a full-automatic laser marking machine for a double-station substrate. The full-automatic laser marking machine comprises a machine frame, a machine table arranged on the machine frame, a substrate feeding mechanism, a separation plate feeding mechanism, a finished product collecting mechanism, a NG product collecting mechanism, a mechanical arm transferring mechanism, a camera scanning and transferring mechanism, a code printing and scanning mechanism, a laser assembly and two material carrying workbenchmechanisms which are arranged on the machine frame, and the material carrying workbench mechanism is provided with a feeding and discharging position. According to the full-automatic laser marking machine, the focal length can be automatically corrected on the substrate through the laser assembly, complete automatic marking of the substrate is realized, the characteristics of small occupied space, high precision and high efficiency are realized, the laser marking efficiency of the substrate is improved by utilizing the two material carrying workbench mechanisms, the laser marking efficiency is greatly improved, and the automation degree is greatly improved.

Description

technical field [0001] The invention relates to the technical field of laser marking equipment, in particular to a double-station fully automatic laser marking machine for substrates. Background technique [0002] Laser marking is a phenomenon in which a laser beam with a high energy density is focused on the surface of the material to be processed, so that the surface of the material is rapidly melted, ablated, and evaporated to form pits. Laser marking has the advantages of non-contact processing, no abrasion, no pollution, clear marking, fast speed, good durability, low production cost, good anti-counterfeiting effect, and high flexibility. With the update of production equipment, the materials used are changing with each passing day. The substrate (flexible circuit board) material, the body is light and thin, soft, easy to deform, and the surface thickness is different. The marking pattern is fine, the marking accuracy is high, and the marking speed is fast. Laser markin...

AI Technical Summary

Problems solved by technology

With the update of production equipment, the applied materials are changing with each passing day. The substrate (flexible circuit board) material, the body is light and thin, soft, easy to deform, and the surface thickness is different. The marking pattern is fine, the marking accuracy is high, and the marking speed is fast. Laser marking Due to the difference in material thickness, manual focus processing is required, and constant adjustment and fixation are required, which not only wastes time but also is inefficient. Therefore, it is necessary to automatically mark the surface of different heights of the workpiece at one time, and perform laser marking at the same time, and can also automate loading and unloading. laser marking machine

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