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A flexible printed circuit board and its manufacturing method

A technology of flexible printing and manufacturing method, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems of tin-copper alloy layer disconnection, increase manufacturing cost, disconnection reliability, etc., and achieve enhanced bending performance , prevent the generation of voids, and reduce the effect of manufacturing costs

Active Publication Date: 2022-03-18
江苏上达半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the solder resist 5 is applied with heat treatment, the copper in the conductive pattern 3 will diffuse to the electroplated tin alloy layer 6 to form a tin-copper alloy layer, which is very brittle.
Therefore, when the flexible printed wiring board is bent and used, the tin-copper alloy layer part is disconnected, and there are problems of disconnection and lowered reliability.
In addition, because the tinning operation is carried out on the whole board, the manufacturing cost is greatly increased

Method used

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  • A flexible printed circuit board and its manufacturing method
  • A flexible printed circuit board and its manufacturing method
  • A flexible printed circuit board and its manufacturing method

Examples

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Embodiment 1

[0034] A method for manufacturing a flexible printed circuit board, the steps comprising:

[0035] First, apply an adhesive 4 on one side of the flexible and insulating plastic film-like insulating substrate 1, and use the adhesive 4 to press the conductor layer 9 on the insulating substrate 1. The conductor used here is preferably copper foil, and the insulation The general thickness of the substrate 1 is 12.5-50 μm, and then the sprocket holes 2 are punched continuously at certain intervals using a mold;

[0036] Then, as the traditional processing method, after the photoresist 7 is coated on the surface of the conductor, the conductor pattern 3 is formed by exposure and etching, and the unnecessary photoresist is removed with an alkaline liquid. Inner pins 3a of semiconductors, outer pins 3b for connection to other printed circuit boards or electronic components, etc., and plating leads used in electrolytic plating, etc.;

[0037] Next, in order to protect the conductor pa...

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Abstract

The invention discloses a flexible printed circuit board, which comprises an insulating substrate, a conductor layer is arranged on the insulating substrate, a sprocket hole is punched on the insulating substrate by a mold, and an electroplated tin alloy layer, a solder resist and a corrosion resist are also included; The conductive layer is etched to form a conductive pattern, and the conductive pattern is printed with a resist except for the connecting terminal, and the connecting terminal in the conductive pattern is provided with an electroplated tin alloy layer; when the resist printed in the conductive pattern is After peeling off, print solder resist on the same position. The present invention prints a layer of resist on the circuit pattern except for the connecting terminals, then electroplates a tin alloy layer at the connecting terminals in the conductor pattern, and then prints the solder resist after peeling off the resist. There is no tin layer below the solder resist to prevent copper from diffusing into the tin layer during heat treatment to form a brittle tin-copper alloy layer, which enhances the bending performance of the product.

Description

technical field [0001] The invention relates to a flexible printed circuit board and a manufacturing method thereof, belonging to the technical field of electronic components. Background technique [0002] In recent years, with the rapid development of the electronics industry, electronic devices have become thinner, smaller, lighter, and shorter, followed by high-density and high-precision requirements for circuit patterns on circuit boards. At present, it is generally used to form circuit patterns on flexible and insulating films such as polyimide, such as figure 1 As shown, using a plastic film-like insulating substrate 1 with flexibility and insulating properties, the adhesive 4 is coated on the insulating substrate 1, and the copper foil is laminated with the adhesive 4 to form a conductor layer; or by sputtering and electroplating, A copper foil conductor layer is formed on the insulating substrate layer, and the insulating substrate layer and the copper foil conducto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/28
CPCH05K1/028H05K1/118H05K3/282H05K2201/2009
Inventor 黄春生杨洁孙彬沈洪李晓华
Owner 江苏上达半导体有限公司
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