Probe station and semi-automatic wafer test equipment
A technology of wafer testing and probe station, which is applied in the field of semiconductors and can solve problems such as easy shaking, unstable fixing of the probe station, and inconvenience for users
Inactive Publication Date: 2019-11-05
深圳市森美协尔科技有限公司
View PDF4 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] The existing semiconductor chip test probe station in our country is easy to shake after working for a long time. When operating the probe, the probe station is unstable because of the unstable fixing of the probe station, which is prone to test errors and brings inconvenience to users.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0023] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0024] Such as Figure 1-4 As shown, in this embodiment, the probe station includes a first movement mechanism, a second movement mechanism and a third movement mechanism. The bottom areas of the first movement mechanism, the second movement mechanism and the third movement mechanism decrease successively, and they are stacked up sequentially. The overall structure is compressed and compact, and the weight of each mechanism gradually decreases from bottom to top, so as to achieve a low center of gravity; the probe station passes through The first kinematic mechanism, the second kinematic mechanism and the third kinematic mechanism control the reciprocating motion of the w...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a probe station for wafer testing. The probe station comprises a first motion mechanism, a second motion mechanism and a third motion mechanism, wherein bottom areas of the first motion mechanism, the second motion mechanism and the third motion mechanism sequentially decrease, and the first motion mechanism, the second motion mechanism and the third motion mechanism are sequentially stacked upwards. The probe station controls a wafer to reciprocate in a first direction, a second direction and a third direction and rotate with the third direction being an axis through the first motion mechanism, the second motion mechanism and the third motion mechanism. The invention further discloses semi-automatic wafer test equipment. The equipment comprises the probe station and a microscope located above the probe station, wherein the microscope simultaneously provides three types of multiplying-power imaging to be compatible with testing of 6-inch, 8-inch and 12-inch wafers. By adopting the design of a low-gravity-center vacuum drying sealing structure and the compatibility with multiple types of wafers, a product has high precision and high stability.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a probe station and semi-automatic wafer testing equipment. Background technique [0002] With the development of domestic semiconductor technology and the establishment of multiple 12-inch fabs and laboratories, the demand for probes for 12-inch wafers has gradually increased. At present, most of the probes for 12-inch wafers rely on imported equipment (Japanese , the United States), and at the same time, there is a situation where demand exceeds demand. For the domestic situation, it is imminent to develop and develop 12-inch wafer testing equipment to solve the current dilemma of only relying on foreign imports. [0003] The existing semiconductor chip test probe station in our country is easy to shake after working for a long time. When operating the probe, the probe station is unstable because of the unstable fixation, which is prone to test errors and brings inconven...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G01R1/02G01R1/04G01R1/067
CPCG01R1/02G01R1/04G01R1/06705G01R31/2601
Inventor 刘世文刘艺
Owner 深圳市森美协尔科技有限公司