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One-way spiral COF coating roller

A roller and spiral technology, applied in the field of COF device preparation, can solve problems such as uneven photoresist, affecting product yield, and failure to form normal circuits.

Pending Publication Date: 2019-11-05
江苏上达半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing upper coating roller (10) with grooves (11) arranged at intervals can only be coated with photoresist with a viscosity ≥ 5.0 cP. When the viscosity of the photoresist is lower than 5.0 cP, the photoresist It will flow back along the groove (11) of the upper coating roller (10) due to gravity, resulting in inability to coat or uneven coating of photoresist, resulting in failure to form normal lines and affecting product yield

Method used

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  • One-way spiral COF coating roller
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Embodiment Construction

[0017] In order to make the above objects, features and advantages of the present invention more obvious and comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0018] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0019] Second, "one embodiment" or "an embodiment" referred to herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. "In one embodiment" appearing in different places in this specification does not all refer to ...

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Abstract

The invention discloses a one-way spiral COF (Chip On Film) coating roller, which comprises a lower coating roller for taking photoresist out and an upper coating roller for transferring the photoresist on the lower coating roller and applying the photoresist to a COF substrate. The upper coating roller is provided with a spiral groove. The beneficial effect is that the spiral groove on the uppercoating roller enables the photoresist to be uniformly applied to a product when the viscosity of the photoresist is reduced, so that backflow generated in the photoresist applying process is reduced.

Description

technical field [0001] The invention relates to a unidirectional spiral COF coating roller, belonging to the technical field of COF preparation devices. [0002] technical background [0003] COF - Chip On Film, a chip on film. By forming a circuit pattern on a COF base material composed of an insulating film and a metal layer, performing surface processing such as electroplating and setting solder resist on the specified area of ​​the circuit pattern, and then mounting electronic components such as ICs in the device mounting area to form a COF product, Assembled and used on other circuit boards. [0004] Among them, a layer of photoresist is coated on the metal layer of the COF substrate (40). The working principle is: the lower coating roller (20) in the coating unit Taken out, the upper coating roller (10) in the coating unit rotates in the opposite direction to the lower coating roller (20), and the photoresist is transferred from the lower coating roller (10) to the up...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/16
CPCG03F7/16
Inventor 叶新智王健杨洁孙彬沈洪李晓华
Owner 江苏上达半导体有限公司