Integrated damping structure for MEMS inertial instrument system

An inertial instrument and vibration-damping structure technology, applied in non-rotational vibration suppression, navigation through velocity/acceleration measurement, etc., can solve problems such as difficult coincidence, instrument output error, etc., to reduce mechanical stress, ensure consistency and uniformity , The effect of simplifying the micro-assembly process

Inactive Publication Date: 2019-11-08
BEIJING AUTOMATION CONTROL EQUIP INST
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Problems solved by technology

[0005] (1) Since the center of mass 16 of the damped object (comprising MEMS inertial instrument 11 and printed circuit board 12) is positioned at one side of the printed circuit board, the support center 17 of the sho

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  • Integrated damping structure for MEMS inertial instrument system
  • Integrated damping structure for MEMS inertial instrument system
  • Integrated damping structure for MEMS inertial instrument system

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[0030] It should be noted that the embodiments in the application and the features in the embodiments can be combined with each other if there is no conflict. The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0031] It should be noted that the terms used here are only for describing specific implementations, an...

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Abstract

The invention provides an integrated damping structure for an MEMS inertial instrument system, and the structure can solve technical problems of the damping structure for the MEMS inertial instrumentsystem in the prior art. The MEMS inertial instrument system comprises an MEMS inertial instrument and a matched printed circuit board, wherein the MEMS inertial instrument is arranged on the printedcircuit board; the integrated damping structure comprises a connecting component and an integrated vibration damper; the outside of the MEMS inertial instrument is sleeved with the connecting component; the connecting component is used for connecting the integrated vibration damper with the MEMS inertial instrument; the connecting component is provided with an annular cavity along the circumferential direction of the MEMS inertial instrument; the integrated vibration damper is used for damping the MEMS inertial instrument system and comprises a plurality of vibration damping elements with thesame shape; the plurality of vibration damping elements are arranged in the cavity at intervals along the circumferential direction of the annular cavity; the plurality of vibration damping elements are in central symmetry and are made of the same elastic material; and the plurality of vibration damping elements are arranged in the cavity in an integrated forming mode.

Description

technical field [0001] The invention relates to the technical field of vibration reduction, in particular to an integrated vibration reduction structure for a MEMS inertial instrument system. Background technique [0002] MEMS inertial instrument is a new type of inertial instrument manufactured on the basis of microelectronics and micromechanical technology. It mainly includes MEMS gyroscope and MEMS accelerometer. It has the advantages of small volume, weight, power consumption, high integration, resistance to harsh environments, and low cost. It is used in the fields of short-term autonomous navigation and attitude stability control. [0003] MEMS inertial instruments are generally composed of a meter head and a measurement and control circuit. A common form of meter head packaging is LCC ceramic shell packaging. In actual use, the ceramic shell is usually welded to the corresponding printed circuit board by surface-mounting. , and the printed circuit board and the housi...

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Application Information

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IPC IPC(8): F16F15/08G01C21/16
CPCF16F15/08G01C21/16
Inventor 刘飞孙刚王汝弢郭中洋张菁华
Owner BEIJING AUTOMATION CONTROL EQUIP INST
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