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Crimp-type IGBT module testing system and method

A module testing and crimping technology, which is applied in the direction of single semiconductor device testing, measuring electricity, measuring devices, etc., can solve the problems that the dynamic characteristics of the crimping IGBT module cannot be applied, and the dynamic testing accuracy is low.

Active Publication Date: 2019-11-08
GUANGDONG POWER GRID CO LTD +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiment of the present application provides a crimping type IGBT module testing system and testing method, which is used to solve the problem that the existing IGBT module dynamic characteristic testing system is not suitable for studying the influence of temperature on the dynamic characteristics of the crimping IGBT module, and the dynamic test accuracy lower technical issues

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  • Crimp-type IGBT module testing system and method
  • Crimp-type IGBT module testing system and method
  • Crimp-type IGBT module testing system and method

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Embodiment Construction

[0037] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the application. Obviously, the described embodiment is only It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0038] For ease of understanding, see figure 1 , an embodiment of a crimping type IGBT module testing system provided by the application, including: a main control unit, an edge trigger circuit unit, a drive circuit unit, a double pulse circuit unit, a pressure control unit, a heating circuit unit, and a correction circuit unit and display unit;

[0039] The edge...

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Abstract

The invention discloses a crimp-type IGBT module testing system and method. A main control unit controls a heating circuit unit to control testing temperature of a crimp-type IGBT module, through an edge trigger circuit unit, an edge trigger signal is provided for a driving circuit unit, a driving unit drives a dual-pulse loop unit to work, a dual-pulse test signal is output to a display unit fordisplay, and the dual-pulse test signal is transmitted to the main control unit through a display unit for dynamic characteristic analysis, and the dynamic characteristic analysis of a crimp-type IGBTat different temperatures is achieved. The time deviations of a voltage signal and a current signal output by the dual-pulse loop unit are corrected by using a correction loop, the problem is solvedthat the time deviations exist between the voltage signal and the current signal to cause lower testing precision, and the technical problems are solved that an existing IGBT module dynamic characteristic testing system cannot be applicable to study on the influence of the temperature on the dynamic characteristics of the crimp-type IGBT module.

Description

technical field [0001] The present application relates to the technical field of semiconductor device testing, in particular to a pressure-connection IGBT module testing system and testing method. Background technique [0002] The press-fit IGBT module is a power module with a new package structure, which has double-sided heat dissipation, no solder joints, no leads, high reliability, low thermal resistance, wide safe operating area (SOA), high power density, and unique failure short circuit Mode and other characteristics, it has a very significant competitive advantage in the application fields of direct series connection, harsh application environment and high reliability requirements in flexible direct current transmission converter valves. [0003] The dynamic characteristics of the IGBT module is an important basis for evaluating the switching performance of the IGBT module. At present, the test system for the dynamic characteristics of the pressure-connected IGBT is a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
CPCG01R31/2601
Inventor 肖磊石盛超卢启付张健唐酿黄辉骆潘钿
Owner GUANGDONG POWER GRID CO LTD
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