Base material-based overlaying piece and overlaying method
A technology of substrates and overlapping areas, applied in the direction of electronic equipment, electrical components, structural parts, etc., can solve problems such as loss of adhesion, production interruption, and easy breakage of splicing tapes, so as to avoid production interruption, improve pass rate and efficiency effect
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[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0022] see figure 1 with figure 2 , figure 1 It is a structural schematic diagram of an embodiment of the first substrate and the second substrate in the substrate-based overlapping piece of the present invention, figure 2 is based on figure 1 Schematic diagram of the structure of an embodiment of the stack of substrates.
[0023] The overlapping piece includes: a first substrate 1 , a second substrate 2 , a slurry layer 3 , a first tape layer 4 , and / or...
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