Laser processing system and laser processing method capable of adjusting line width

Abstract

The invention discloses a laser processing system and a laser processing method capable of adjusting line width, and relates to the technical field of laser processing. The laser processing system comprises a laser device, a beam expanding mirror, a beam deflection assembly, a zoom lens set and a processing platform, wherein the laser device is used for emitting laser beams, the beam expanding mirror is used for expanding and collimating the laser beams, the beam deflection assembly is used for deflecting the laser beams and enabling the laser beams to do reciprocating motion back and forth, the zoom lens set is used for focusing the laser beams on a workpiece to be processed, the processing platform is used for bearing the workpiece to be processed and controlling the workpiece to be processed to do directional movement, and the laser beams emitted by the laser device sequentially pass through the beam expanding mirror, the beam deflection assembly and the zoom lens set and then forma laser scanning track with the certain line width on the workpiece to be processed. According to the laser processing system provided in the embodiment, the width of a laser processing line can be freely adjusted. In addition, the invention further provides the laser processing method capable of adjusting the line width in the other embodiment.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing system and a laser processing method with adjustable line width. Background technique [0002] The workpiece to be processed is often made of different materials. Various materials have corresponding energy absorption ranges for different wavelengths of laser light. Only by controlling the laser pulse energy within a suitable range can ideal processing be obtained on the material to be processed. Effect. When the laser pulse energy is lower than or slightly higher than the minimum energy absorbed by the material to be processed, the laser will not be fully absorbed by the material to be processed, and it is difficult to obtain the ideal laser processing effect; when the laser pulse energy is higher than the material to be processed At the highest value of energy that can be absorbed, the laser will cause excessive ablation of the material to be proces...

AI Technical Summary

Problems solved by technology

When the laser pulse energy is lower than or slightly higher than the minimum energy absorbed by the material to be processed, the laser will not be fully absorbed by the material to be processed, and it is difficult to obtain the ideal laser processing effect; when the laser pulse energy is higher than the material to be processed At the highest value of energy that can be absorbed, the laser will cause excessive ablation of the material to be processed, causing scorching and carbonization on the material to be processed, resulting in processing failure

[0003] In the existing laser processing technology, the diameter of the focused spot of the laser is generally small (about 10-20um). In order to obtain a wider laser processing line width, for example, process a 60um line width If it is a straight line, it is necessary to make the laser scan back and forth to form multiple laser scanning trajectories. By superimposing multiple laser scanning trajectories, a scanning track with a wider diameter than a single focused spot is obtained. Laser scanning back and forth on the material to be processed will inevitably result in the accumulation of laser energy. , it is easy to cause excessive ablation of the material to be processed; and if the focused spot is directly expanded (for example, by adjusting the focal length of the focusing mirror to increase the focused spot to 60um), the laser energy density will decrease due to the increase in the area of ​​the focused spot, and the laser’s The pulse energy may not be fully absorbed by the material to be processed, and it is difficult to achieve the expected processing effect

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