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Heating field device of molding three-dimensional continuous glass molding device

A molding device and three-dimensional technology, applied in glass forming, glass re-molding, glass manufacturing equipment and other directions, can solve the problems of insufficient pressure bearing, inability to ensure the dimensional accuracy of molded three-dimensional glass products, and insufficient heat conduction. The effect of ensuring precision

Pending Publication Date: 2019-11-15
秦文隆
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] However, in the aforementioned patent, since the heating block is integrally formed of a metal material with good heat conduction, and the heating block is fixed on the base with a detachable element, the heat conduction of general metals is still not fast enough, so that the heat conduction of the thermal field formed by the heating block and the heating element and temperature uniformity still have room for improvement
Furthermore, since the heat of the heating block is directly transmitted to the metal base, the base may be deformed due to high temperature, and the pressure bearing capacity is insufficient, which cannot ensure the accuracy of the molded three-dimensional glass product size.

Method used

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  • Heating field device of molding three-dimensional continuous glass molding device
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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the examples given are not intended to limit the present invention.

[0017] The present invention is especially aimed at the new design of the heating device structure of the three-dimensional glass continuous molding device. First, please refer to figure 1 , figure 2 As shown, the heating thermal field device of the present invention is arranged in the continuous molding device of molded three-dimensional glass. The road 2 is arranged inside the furnace body 1 and is connected to the exchange system 4 arranged on both sides of the furnace body 1. It is a closed type, and the protective gas is introduced (the device for providing protective gas is a common technology, so I won’t go into details), and according to the process, there are heating an...

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Abstract

The invention provides a heating field device of a molding three-dimensional continuous glass molding device. The heating field device consists of a graphite heating block and a base which are integrally molded by a material with good heat conductivity, wherein the heating block has a proper number of groove holes which are tightly combined with heating elements to form a heating field; a bearingplate made of a porous ceramic material is arranged between the heating block and the base; the heating block is fixed on the base through a detachable element; and the base is fixed in a preset position of a molding device through a detachable element. As the heating field has good heat conductivity and temperature uniformity, a molded three-dimensional glass product is small in internal stress and high in molding pass percent, and the precision of sizes of products can be ensured.

Description

technical field [0001] The invention relates to the technical field of a heating thermal field device, in particular to a heating thermal field device for molding a three-dimensional glass continuous molding device. Background technique [0002] Nowadays, because of the high light transmission properties of glass, display devices (such as mobile phones, watches and other electronic products) often choose it as the shell of the window part. You can see that the surface of handheld electronic products is usually provided with a glass casing to protect the display module inside the product. At present, most of the glass casings are in the shape of a flat plate, so a seam will be formed on the upper surface of the electronic product. Furthermore, because a certain width of the mechanism must be reserved around the electronic product to hold the flat glass, the top surface of the electronic product cannot be fully utilized. Therefore, three-dimensional or curved glass has been ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B23/03
CPCC03B23/0307
Inventor 秦文隆
Owner 秦文隆
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