Cutting chip identification method for bending unit
A bending unit, bending tool technology, applied in the direction of using optical devices, optical device exploration, safety equipment, etc.
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[0056] First of all, it should be ensured that in the differently described embodiments, the same parts have the same reference signs or the same component designations, and that the disclosure content contained in the entire description can be transferred reasonably to the components with the same reference signs or the same component names. same parts. The selected position descriptions in the description, such as for example top, bottom, side, etc., refer to the currently described and shown figures and in the event of a position change, these position descriptions can be appropriately transferred to the new position.
[0057] exist figure 1 A bending unit 1 is schematically shown in , which can be used in the method according to the invention. The bending unit 1 has a horizontal pressure beam 2 which is designed to be reciprocated in a direction of movement 23 by a drive unit not shown in detail. Upper tool 4 can be directly arranged on the pressure beam 2, or as figure...
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