The invention relates to a gripper (1), in particular a Bernoulli gripper for holding two-dimensional components such as 
silicon-based wafers (2) with a low degree of loading, having a clamping ring (4) connected to a controllable 
robot arm (3), having a baffle plate (6) which is connected to the clamping ring (4) by means of a funnel-shaped component (5) and has a gripping face (7) which communicates with a flow 
system (8) which passes through the funnel-shaped component (5) and the baffle plate (6) and by means of which, after an excess pressure has been applied to the Bernoulli gripper (1),a negative pressure is to be produced on the gripping face (7) of the baffle plate (6) in order to attach by suction the 
wafer (2) to be gripped, having a rubberized 
bearing surface (9) of a bearingring (10) which is integrated in the gripping face (7) and provides a slip-resistant movement of the 
wafer (2) attached to the gripping face (7) by suction, and having a sensor (11) for detecting thewafer (2) attached to the gripping face (7) by suction. In order to permit an extremely shock-resistant attachment of the 
wafer to be gripped on the gripping face of the gripper, the invention provides a damping device (12) which is circumferentially adapted to the gripper (1), the contour of which device, as viewed in the plan view of the gripper (1), protrudes circumferentially above the contourof the latter, and which device forms such a damping resistance for the wafer (2) to be gripped during its suction-induced approach towards the gripping face (7) that the wafer (2) comes to bear in ashock-free manner against the rubberized 
bearing surface (9) of the bearing ring (10).