The invention discloses a manufacturing method of a chip type alloy foil resistor, and belongs to the technical field of alloy foil resistors. According to the present invention, by adopting a uniform hexamethyldisilazane process, the adhesive force of photoresist is improved, and the side etching of a foil is effectively reduced; the reliability is improved by adopting an aging process; the manufactured chip type alloy foil resistor is high in precision and small in resistance temperature coefficient; within a wider temperature coefficient range, the temperature coefficient is automatically compensated, a tracking temperature coefficient is extremely small, the noise is small, the stability is high, the high-frequency characteristic is good, the response is fast, and the distribution parameter is small; the method can be applied to precision measurement, digital-to-analog conversion, aviation and navigation inertial navigation systems, computer interface circuits and some systems with special requirements, and is suitable for large-scale popularization.