This discloses an
electronic component of a miniature size to be used as e.g. automobile engine
peripheral components, such as an
exhaust gas oxygen sensor, a heat sensor, and a heater. More specifically, the invention provides an
electronic component integral with a
heat resistant terminal that is pressure-fitting or shrink-fitted on a
ceramic element of the
electronic component. This electronic components shows great mechanical and
electrical performance, withstanding the high temperature environment over 400 and up to 800 DEG C. to which the
ceramic element of the component required
expose. The terminal incorporated in this high temperature electronic component comprises a plurality of
metal wire leads that electrically connect to a surface of a bar-like
ceramic element, at least two
ceramic insulators that surround the leads, and a thermal resistant
metal ring that shrink-fits or pressure-fits around the
ceramic insulators so that the
metal leads press in a radial direction holding the element firmly. The thermal resistant metal ring to be used for this shrink fit or pressure fit is preferably made of an
alloy, such as Incoloy 909,
Inconel 650, and Waspaloy, and the like, thereby preventing the metal leads from coming off at high temperature. The terminal integrated with the ceramic element by the
shrink fitting method according to the invention, minimizes the number of parts, attaining a
miniaturization of such high temperature electronic component at a low cost.