Packaging equipment for integrated circuit production and processing
A technology for packaging equipment and integrated circuits, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., to achieve the effects of diversifying development methods, shortening development cycles, and saving mold opening costs
Active Publication Date: 2020-11-10
张延华
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Problems solved by technology
[0005] There is no relevant device in the prior art that can be used for the packaging of integrated circuits of different sizes
Method used
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[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0036] Such as figure 1 As shown, a packaging device for integrated circuit production and processing includes a top mold assembly 1, a bottom mold assembly 2 and an injection tube 8, and the top mold assembly 1 and the bottom mold assembly 2 are driven up and down by a movable frame. Clamping and parting of the mold by movement, the surface of the top mold assembly 1 and the bottom mold assembly 2 facing each other is provided with a shape-adjustable injectio...
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The invention discloses a packaging device for integrated circuit production and processing. The device comprises a top mold component, a bottom mold component and an injection tube. The injection tube penetrates from the top of the top mold component into the top mold component and extends to an injection cavity. The bottom mold component comprises a number of mold pillars. Four sides of each mold pillar are rectangular. The mold pillars are arranged next to each other in the plane direction. Each mold pillar independently moves vertically. A number of mold pillars are provided with shape-adjustable injection cavities on face-to-face surfaces of the top mold component and the bottom mold component. Each mold pillar comprises a bottom pillar, a pin sheet pressure plate, a guide post and anelastomer. A number of pressure plate mounting holes are arranged in the upper surface of each bottom pillar. A number of pin sheet pressure plates are arranged at the top of the bottom pillars in the form of caps. The guide posts are arranged on the lower surfaces of the inner sides of the pin sheet pressure plates. The guide posts are inserted downward into the pressure plate mounting holes. Vertically arranged elastomers are arranged between the pin sheet pressure plates and the bottom pillars.
Description
technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to packaging equipment for integrated circuit production and processing. Background technique [0002] Integrated circuit packaging, that is, a protective layer is wrapped around the original integrated circuit where the chip, substrate, and pins have been welded or bonded together. More than 80% of the existing technologies use plastic layer packaging, and some are metal layer or ceramic layer. Packaging provides a stable and reliable working environment for the chip, and protects the chip mechanically and in terms of the working environment, so that the integrated circuit chip can perform normal functions and ensure its high stability and reliability. [0003] The injection molding packaging of the existing technology is generally completed in a specific mold, and each size of integrated circuit needs a separate mold for packaging, but for small batch product...
Claims
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IPC IPC(8): H01L21/56
CPCH01L21/565
Inventor 郝建华李会斌李子考
Owner 张延华