Semiconductor cooling part edge banding device
A technology of edge banding device and refrigeration parts, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as waste of labor and troublesome operation, and achieve the effects of reducing labor, easy operation, and improving production efficiency
Pending Publication Date: 2019-11-15
许昌市森洋电子材料有限公司
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Problems solved by technology
[0003] In the prior art, the technical scheme adopted for sealing the edges around the semiconductor cooling parts is: the worker holds the semiconductor cooling parts with his hands, dips the edge of the cooling parts into the glue, and the glue is filled in the glue. In the liquid tank, since the semiconductor refrigerator has four sides, one semiconductor refrigerator needs to be sealed four times, which has the disadvantages of troublesome operation and waste of labor.
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[0020] The present invention will be further described below in conjunction with the accompanying drawings.
[0021] As shown in the figure, a semi-conductor refrigerator edge sealing device is characterized in that it includes a frame 1, the frame has a rear end 3 for installing the refrigeration element 2 and the sealing is completed after removing the refrigeration element. The front end 4 of the motor, and the transmission roller driven by the motor are installed at the rear end and the front end of the frame, which are respectively the rear transmission roller 5 and the front transmission roller 6. The transmission roller has a sprocket 7, and a chain 8 is wound on the chain A circular structure is formed on the wheel, and a connecting piece 9 is connected to the chain. Below the connecting piece is a ∩-shaped structure with an opening facing downwards. The ∩-shaped structure has two legs 9a, and a rotating shaft 10 is installed on the legs Above, gears 11 are installed o...
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The invention relates to the technical field of semiconductor cooling part production equipment, in particular to a semiconductor cooling part edge banding device. The device comprises a frame. A rotating shaft is mounted on support legs. Gears are mounted outside the support legs. Chucks are mounted on the inner sides of the support legs respectively. There is a station for clamping a cooling part between the two chucks. Three racks arranged at intervals in the front-back direction are mounted on a side of the frame. The racks have an opportunity of being meshed with the running gears. The length of each rack is 1 / 4 of the circumference of each gear. A lifting cylinder, which is a first cylinder, is mounted under a rear chain of the frame, and the first cylinder is provided with a rubberliquid groove. Three lifting cylinders, which are a second cylinder, a third cylinder and a third cylinder respectively, are mounted under the frame and behind the racks respectively, and the second cylinder, the third cylinder and the fourth cylinder are respectively provided with rubber liquid grooves. The semiconductor cooling part edge banding device has the advantage that the device can reduce labor force and improve the production efficiency and is simple and convenient to operate.
Description
technical field [0001] The invention relates to the technical field of production equipment for semiconductor refrigeration parts, in particular to an edge sealing device for semiconductor refrigeration parts. Background technique [0002] The semiconductor refrigerating element includes a porcelain plate and grains welded on the porcelain plate. The semiconductor refrigerating element is a square structure with four sides. During use, the porcelain plate of the semiconductor refrigerating element will be damaged, for example Bumping and other damage to the porcelain plate, applying adhesive glue around the porcelain plate to seal the edge is an effective way to reduce the damage of the porcelain plate. [0003] In the prior art, the technical scheme adopted for sealing the edges around the semiconductor cooling parts is: the worker holds the semiconductor cooling parts with his hands, dips the edge of the cooling parts into the glue, and the glue is filled in the glue. In ...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 付国军陈磊陈建民王丹赵丽萍张文涛钱俊有
Owner 许昌市森洋电子材料有限公司