Method for producing electronic control module
A technology of electronic devices and electronic sensors, which is applied in the direction of printed circuits connected with non-printed electrical components, final product manufacturing, printed circuit manufacturing, etc., can solve problems such as long time and consumption, and reduce manufacturing costs and manufacturing costs , time and energy saving effect
Active Publication Date: 2019-11-15
ROBERT BOSCH GMBH
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] A disadvantage of the hitherto known methods for producing electronic sensor modules is that they are very labor-intensive and take a long time
Method used
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Embodiment Construction
[0028] figure 1 A schematic cross-sectional view of a printed circuit board element 20 of an embodiment of a control module according to the invention is shown. figure 2 show from figure 1 A top view of the circuit board component 20.
[0029] The circuit board element 20 may be, for example, a printed circuit board (PCB). The electrical connections within the circuit board element 20 are not shown in the drawing. The circuit board element 20 has a centrally arranged recess 30 which extends over the entire height of the circuit board element 20 . The height is at figure 1 extends from above to below and in figure 2 Extend into or out of the drawing plane. A center line 35 runs centrally through the recess 30 .
[0030] Three mechanical solder pads 26 , 27 , 28 are arranged on the circuit board element 20 . The mechanical soldering pads are each arranged at an angle offset by approximately 90° around the center line 35 .
[0031]The mechanical soldering pads 26 , 27 ...
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A method for producing an electronic sensor module (10) for measuring at least one measurement value, in particular for a transmission controller, is proposed, wherein the method comprises the following steps: providing a printed circuit board element (20); providing a sensor element (70); providing a sensor carrier (50) having a sensor receptacle (61) for holding the sensor element (70), whereinthe sensor carrier (50) has electrical connecting lines between soldering pads (62-69) of the sensor receptacle (61) and electrical soldering pads (21, 22, 23) of a printed circuit board element contact side (55) of the sensor carrier (50), wherein the sensor receptacle (61) is formed on a side of the sensor carrier (50), which side faces away from the printed circuit board element contact side (55); applying first soldering material onto electrical soldering pads (21, 22, 23) of the printed circuit board element (20) and / or onto the electrical soldering pads (51, 52, 53) of the printed circuit board element contact side (55) of the sensor carrier (50); arranging the sensor carrier (50) with the electrical soldering pads (51, 52, 53) of the printed circuit board element contact side (55) on the electrical soldering pads (21, 22, 23) of the printed circuit board element (20) to produce in each case an electrical connection between the connecting line and the printed circuit board element (20) by means of the first soldering material; applying second soldering material onto electrical connecting elements (71-78) of the sensor element (70) and / or onto the soldering pads (62-69) of thesensor receptacle (61); arranging the sensor element (70) in the sensor receptacle (61) in such a way that the second soldering material produces in each case an electrical connection between the electrical connecting elements (71-78) of the sensor element (70) and the soldering pads (62-69) of the sensor receptacle (61) by means of the second soldering material; and reflow-soldering the first soldering material and the second soldering material in a joint reflow-soldering process.
Description
technical field [0001] The invention relates to a method for manufacturing an electronic control module. Background technique [0002] In a transmission control device, typically at least one first measured value must be detected or measured. The transmission control often includes an electronic sensor module which has a circuit board element on which the electronics are arranged. The sensor element or sensor is arranged at a distance from the circuit board element by means of a sensor carrier or sensor dome and is electrically connected to the circuit board element. The height of the sensor dome can be selected such that the sensor element or the sensor is arranged at a defined distance from the object to be measured or from the circuit board element. [0003] The sensor carrier or sensor projection is mechanically fastened to the circuit board element and is electrically connected to the circuit board element. The sensor element or sensor is likewise connected mechanica...
Claims
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IPC IPC(8): H05K1/18H05K3/34H05K3/30H05K1/14
CPCH05K1/141H05K1/181H05K1/183H05K3/301H05K3/341H05K3/3494H05K2201/10151H05K2201/10378H05K1/111H05K3/3457
Inventor U.克斯U.卡特岑瓦德尔P.魏贝尔勒
Owner ROBERT BOSCH GMBH