Chip double-sided alignment bonding machine

Abstract

The invention discloses a double-sided alignment bonding machine for a chip. The manipulator comprises a top chuck with a first identifier, a bottom chuck with a second identifier, a mechanical arm, afirst driving mechanism and a second driving mechanism, wherein the bottom chuck is arranged below the top chuck; the mechanical arm is arranged between the top chuck and the bottom chuck; the firstdriving mechanism is used for driving the top chuck; the second driving mechanism is used for driving the bottom chuck to move transversely; a first vacuum chuck is arranged on the lower end face of the top chuck and used for adsorbing an upper wafer with a third identifier, and the chip double-face alignment bonding machine is simple in structure, easy to operate and short in alignment operationtime consumption.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip double-sided alignment bonding machine. Background technique [0002] Wafer bonding technology refers to the close contact of two homogeneous or heterogeneous wafers with smooth surfaces, and through the action of an external field, they are bonded to each other to form a whole. In the manufacturing and packaging process of semiconductor devices and integrated circuits, wafer bonding technology plays an important role. With the continuous development of semiconductor devices in the direction of high performance, high integration, and small size, the diversity of structures is also increasing. More and more device manufacturing processes require double-sided alignment bonding to achieve special Device structure. Such as TSV packaging process, cavity structure preparation, etc. Therefore, semiconductor bonding equipment is required to have a double-sided alignment ...

AI Technical Summary

Problems solved by technology

[0003] In the existing double-sided alignment bonding technology, one is to pre-align the alignment equipment outside the bonding machine, and send it to the bonding machine via the bonding fixture for bonding. Such double-sided The alignment method takes a long time and has high requirements for bonding fixtures. During the sample delivery process, the pre-aligned wafers are more likely to slide relative to each other; the second method is to configure alignment equipment in the bonding machine, usually An alignment camera is arranged on the top and bottom of the bonding chamber, the bottom camera aligns the top chuck with the wafer, and the top camera aligns the bottom chuck with the wafer, and the wafer is aligned by alternately using the upper and lower cameras Alignment, this method increases the complexity and cost of system design, increases the difficulty of operation, and at the same time, the alignment operation is more complicated and time-consuming

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