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Flexible light-emitting panel, preparation method of flexible light-emitting panel and display equipment

A technology for light-emitting panels and display devices, applied in semiconductor/solid-state device manufacturing, organic semiconductor devices, electrical components, etc., can solve the problems of insufficient release of bending stress and delamination of functional layers, so as to avoid interlayer delamination, The effect of improving product yield

Inactive Publication Date: 2019-11-22
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology

[0003] At present, due to the need to maintain its bending characteristics, flexible light-emitting panels need to prepare multiple functional layers such as light-emitting devices and Thin-Film Encapsulation (TFE) on flexible substrates. When bending flexible light-emitting panels, due to Bending stress cannot be fully released, thus causing delamination between multiple functional layers

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[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0038] In the related art, in order to meet the bending characteristics of the flexible display device, the light emitting device needs to be prepared on the flexible substrate. Therefore, in the manufacturing process, PI will be coated on the glass substrate first, and then the subsequent array segment (Array) and electroluminescent segment (EL) processes will be performed to complete the preparation and packaging of the flexible display device. However, the design of the exter...

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Abstract

The invention discloses a flexible light-emitting panel, a preparation method of the flexible light-emitting panel, and display equipment. The flexible light-emitting panel comprises: a back plate; anadhesive layer that comprises a first sub-adhesive layer arranged on the back plate and a plurality of second sub-adhesive layers protruding in the direction away from the back plate from the first sub-adhesive layer; a flexible layer arranged on the first sub-adhesive layer, wherein the flexible layer comprises a plurality of sub-flexible layers arranged at intervals, the second sub-adhesive layers are located in the intervals, and the second sub-adhesive layers correspond to the intervals in a one-to-one mode; an array substrate, a light-emitting device and a packaging layer are sequentially arranged on each sub-flexible layer in a stacked mode, and a cover plate is arranged on the packaging layer and the second sub-adhesive layers in a covering manner. According to the invention, interlayer stripping among a plurality of functional layers for preparing the flexible light-emitting panel can be avoided, and the product yield is improved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a flexible light-emitting panel, a method for preparing the flexible light-emitting panel, and a display device. Background technique [0002] In recent years, with the development of display technology, display devices such as mobile phones and tablet computers have been accepted by users for their portability. Compared with ordinary displays, bendable displays have the advantage of being bendable, twisted or rolled up, making high Resolution, large-size display requirements and device portability are no longer contradictory. [0003] At present, due to the need to maintain its bending characteristics, flexible light-emitting panels need to prepare multiple functional layers such as light-emitting devices and Thin-Film Encapsulation (TFE) on flexible substrates. When bending flexible light-emitting panels, due to Bending stress cannot be fully released, thus causing ...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/12H10K50/8426H10K71/00H10K71/80H10K59/1201H10K2102/311H10K50/868H10K59/40
Inventor 王芳
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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