Electronic device

A technology for electronic equipment and fans, which is applied in the structural parts of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc. It can solve the problems of high temperature of electronic equipment and affect user experience, so as to improve heat dissipation efficiency, reduce temperature, The effect of improving user experience
CN110494013AInactive Publication Date: 2019-11-22LENOVO (BEIJING) LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
LENOVO (BEIJING) LTD
Publication Date
2019-11-22
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The embodiment of the invention discloses electronic device. The electronic device comprises: a shell provided with a containing cavity and provided with an air inlet and an air outlet; a fan that isarranged in the containing cavity; a functional assembly that is arranged in the containing cavity; a heat dissipation assembly that is arranged in the containing cavity and is used for dissipating heat of the functional assembly; the fan can suck air from the air inlet, so that the air is blown to the functional assembly in a first direction and blown to the heat dissipation assembly in a seconddirection, and the air subjected to heat exchange with the functional assembly and the heat dissipation assembly is guided out of the air outlet; the first direction is different from the second direction. According to the electronic device provided by the embodiment of the invention, heat on the surface of the functional assembly can be directly taken away through the fan, and the temperature ofthe surface of the functional assembly is effectively reduced, so that the temperature of the electronic device is effectively reduced.
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Description

technical field

[0001] The embodiment of the present application relates to an electronic device. Background technique

[0002] Electronic equipment is often used by people. Electronic equipment generally includes a housing, a functional component and a heat dissipation component disposed in an accommodating cavity of the housing; and the heat dissipation component dissipates heat for the functional component. However, the electronic devices in the prior art are designed to be thinner and thinner, and the heat on the surface of the functional components will directly lead to a higher temperature of the electronic device, affecting user experience. Contents of the invention

[0003] The embodiments of the present application provide an electronic device to solve the problems existing in the prior art.

[0004] The technical scheme of the embodiment of the application is realized in this way:

[0005] An embodiment of the present application provides an electronic device, ...

Claims

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