Check patentability & draft patents in minutes with Patsnap Eureka AI!

Semiconductor element package and autofocusing device

一种半导体、元件的技术，应用在自动聚焦装置领域，能够解决失去视力等问题，达到优异散热特性、散热特性优异、机械稳定性优异的效果

Active Publication Date: 2019-11-22
LG INNOTEK CO LTD
View PDF8 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When strong light emitted from a semiconductor device package is directly incident on human eyes, there is a risk that people may lose their eyesight

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor element package and autofocusing device
  • Semiconductor element package and autofocusing device
  • Semiconductor element package and autofocusing device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0134] According to the first embodiment, when it is detected that the diffusion member 140 is separated from the case 130 , the circuit board 160 may cut off the driving power supplied to the semiconductor element 120 . In addition, the circuit board 160 may maintain the driving power supplied to the semiconductor element 120 when the diffusion member 140 is generally attached to the case 130 .

[0135] In the following, refer to Figure 1 to Figure 5 An example of a method of detecting whether the diffusion member 140 is separated from the case 130 and controlling the driving power supplied to the semiconductor element 120 in the semiconductor element package 100 according to the first embodiment will be described.

[0136] According to the semiconductor element package 100 according to the first embodiment, the circuit board 160 may include a detection circuit. The detection circuit may detect an electrical short between the fifth bonding part 177 and the pad 153 or an ele...

no. 3 example

[0194] The third embodiment presents a structure combining the sensing part of the first embodiment and the protective layer 144 of the second embodiment. Therefore, in the third embodiment, the same reference numerals are assigned to elements having the same shapes and functions as those of the first and second embodiments, and detailed descriptions thereof will be omitted.

[0195] The semiconductor element package 100B according to the third embodiment may include a substrate 110, a semiconductor element 120, first and second electrodes 181 and 182, first and second connection wirings 185 and 186, first and second bonding portions 183 and 184 , substrate 110 , housing 130 and diffusion member 140 .

[0196] The semiconductor element package 100B according to the third embodiment may further include sensing means for sensing the deviation of the diffusion unit 140 . The sensing part may include third to sixth coupling parts 147, 149, 177 and 179 and third to sixth connectio...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A semiconductor element package comprises a semiconductor element arranged above a first substrate; first and second electrodes arranged above the first substrate and electrically connected to the semiconductor element; a housing which is arranged above the first substrate and arranged around the semiconductor element, and which has a stepped portion in the upper area thereof; a diffusion portionarranged on the stepped portion of the housing and arranged above the semiconductor element; and a plurality of via holes penetrating the first substrate and the housing.

Description

technical field [0001] Embodiments relate to a semiconductor element package and an autofocus device including the semiconductor element package. Background technique [0002] Semiconductor elements including compounds such as GaN, AlGaN, etc. can have many advantages such as wide and easily adjustable bandgap energy, etc., and can be variously used for semiconductor devices, light receiving elements, and various diodes. [0003] In particular, light-emitting devices such as light-emitting diodes or laser diodes using compound semiconductor materials including group III-V elements or group II-VI elements have the potential to achieve such things as red light, green light, Advantages of various colors of light such as blue light and ultraviolet light. In addition, a light emitting device such as a light emitting diode or a laser diode using a compound semiconductor material including group III-V elements or group II-VI elements can realize high-efficiency white light by usin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/36H01L33/58H01L33/62G01R31/02
CPCH01L33/58H01L33/62H01L2933/0091H01L33/486H01L33/105H01L33/641H01L33/38
Inventor 李建和金度烨金明燮金伯俊
Owner LG INNOTEK CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com