Unlock instant, AI-driven research and patent intelligence for your innovation.

A method for measuring thermal resistance of multilayer materials by layer by layer

A technology of thermal resistance and multi-layer structure, applied in the direction of thermal development of materials, complex mathematical operations, etc.

Active Publication Date: 2022-03-15
BEIJING UNIV OF TECH
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention proposes a new method for the situation that cannot be handled by the traditional structure function method. By collecting the original transient response curve containing all data points, performing multiple iterations and shifting processing on it, the heat of each layer of material is extracted layer by layer. blocking information

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method for measuring thermal resistance of multilayer materials by layer by layer
  • A method for measuring thermal resistance of multilayer materials by layer by layer
  • A method for measuring thermal resistance of multilayer materials by layer by layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments.

[0028] The test device for this method is figure 1 shown. It includes a material to be tested 1 , a heat source 2 , a temperature acquisition device 3 and a computer 4 . The material 1 to be tested is a three-layer material, which meets the requirement that there is a layer of low heat capacity material between two layers of high heat capacity materials; the heat source 2 heats the upper surface of the material; the temperature acquisition device 3 is used to measure the temperature change with time on the upper surface of the material ; Computers are used for data processing.

[0029] The flow chart of this method is as image 3 shown, including the following steps:

[0030] 1. Use the temperature acquisition device 1 to collect the temperature change with time at the heat source 2, the sampling rate is 1MHz, and save all data point...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for measuring thermal resistance of multilayer materials layer by layer belongs to the technical field of electrical and thermal measurement of electronic devices. The device includes the measured material, heat source, temperature acquisition equipment and computer. The method measures the curve of the heat source temperature changing with time, that is, the transient thermal response curve; then, according to the thermal resistance information obtained by the traditional structure function method, the thermal response curve of each layer of material before the thin layer material is further constructed, and its are subtracted from the overall curve, thereby extracting the thermal resistance information of the thin layer. The invention distinguishes two materials with similar thermal time constants, and improves the measurement accuracy of thin-layer thermal resistance under special conditions.

Description

Technical field: [0001] The invention discloses a method for measuring thermal resistance of multilayer materials, belonging to the technical field of electrical and thermal measurement of electronic devices. Background technique: [0002] The structure function method based on deconvolution operation is recognized as an important method for measuring the thermal characteristics of electronic devices and systems. It is based on the measured transient temperature response curve and performs a series of numerical transformations to extract the thermal resistance and thermal capacity of each structural layer inside the device. However, in the actual measurement process, for complex multi-layer materials, especially when a high thermal resistance (low thermal capacity) thin layer material is located between two high thermal capacity materials, the thermal resistance information of the thin layer material will be submerged in the adjacent In the material layer, the compositional...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20G06F17/15
CPCG01N25/20G06F17/15
Inventor 冯士维何鑫白昆郑翔胡朝旭李轩张亚民
Owner BEIJING UNIV OF TECH