Grinding and polishing device

A technology of grinding and polishing, base, used in measuring devices, grinding/polishing equipment, grinding machines, etc., can solve problems such as poor grinding and polishing accuracy

Active Publication Date: 2021-05-18
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a grinding and polishing device, which is used to solve the problem that the existing grinding and polishing device has poor control over the grinding and polishing precision of the sample, so as to improve the grinding and polishing quality of the sample

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The specific implementation of the grinding and polishing device provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0041] In the process of grinding the sample with a grinding and polishing device with a T-shaped mold base, after the sample is fixed on the sample base of the grinding and polishing device by hot melt adhesive or other peelable glue, the sample base is inserted into the T-shaped mold base. In the card slot, the two pedestals at the bottom of the T-shaped mold base and the three fulcrums of the sample form a plane together, and the sample is manually polished or automatically polished by the grinding and polishing machine to prepare a sample with a flat surface. In order to carry out other treatments such as physical and chemical property analysis on the surface of the sample after grinding and polishing.

[0042] However, the current grinding and polishing device can only roughly adjust th...

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PUM

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Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a grinding and polishing device. The grinding and polishing device includes: a T-shaped mold base, including a first beam extending along a first direction and a second beam connected to the first beam and extending along a second direction, the first direction being perpendicular to the the second direction; the base, located on the first beam, is used to adjust the horizontal state of the sample to be ground and polished along the first direction; the first adjustment structure, connected to the base, is used to drive the The base is moved in a third direction perpendicular to the first direction and the second direction and exhibits the base extending beyond the first height of the first beam. The invention improves the control precision of the grinding and polishing height of the sample to be ground and polished, improves the grinding and polishing quality, and further improves the flatness and analyzability of semiconductor products.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a grinding and polishing device. Background technique [0002] As technology develops, the semiconductor industry is constantly seeking new ways to produce a greater number of memory cells per memory die in a memory device. In non-volatile memory, such as NAND memory, one way to increase the memory density is by using vertical memory arrays, that is, 3D NAND (three-dimensional NAND) memory; From 32 floors to 128 floors, or even higher. [0003] In the failure analysis process of semiconductor devices such as 3D NAND memory, grinding and polishing is one of the important steps in the experimental processing of semiconductor structures to form a flat surface. However, in the existing grinding and polishing device, the precision control of the grinding and polishing of the sample is poor, and the quantitative control cannot be realized, thus affecting the quali...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B19/22B24B29/02B24B41/02B24B41/06B24B41/00B24B49/00G01N1/32G01N1/28
CPCB24B19/22B24B29/02B24B41/00B24B41/02B24B41/06B24B49/00G01N1/286G01N1/32G01N2001/2866
Inventor 李亨特
Owner YANGTZE MEMORY TECH CO LTD
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