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Hidden indentation design method

A design method and invisible technology, applied in the direction of metal processing, etc., can solve the problems of sticking and dropping, and achieve the effect of solving the problems of sticking and dropping, appearance and function guarantee.

Inactive Publication Date: 2019-12-10
SHENZHEN LLMACHINECO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to solve the problem of camera foam products sticking back and falling off without substrate glue, and to ensure the production feasibility of the invisible shrinkage design method

Method used

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Embodiment Construction

[0028] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0029] Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless expressly stated otherwise, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0030] In describing the present invention, it is to be understood that the terms "one end", "the other end", "outer side", "upper", "inner side", "horizontal", "coaxial", "central", "end ", "length", "outer end" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the d...

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Abstract

The invention discloses a hidden indentation design method which involves a product body and camera foam. The product body comprises a non-base-material adhesive layer, a backward-adhering film, an adhesive and adhesive tape. A handle and a cutter line are arranged on the non-base-material adhesive layer. A traditional process cannot solve the problem of after-tack chip falling of the non-base-material adhesive, and mass production is not feasible. After the method is used, the problem of after-tact chip falling is well solved, the appearance and functions of the product can all be ensured, and mass production is feasible.

Description

technical field [0001] The invention relates to the field of die-cutting processing, in particular to a design method for invisible shrinkage. Background technique [0002] In the die-cutting process, the traditional method is to punch the inner frame of the product first, then punch the handle to pull off the waste at the handle, and finally cut the shape, as follows figure 1 shown. [0003] This traditional method cannot solve the problem of sticking back without substrate adhesive, and the defect rate of chip dropping is over 80%, which is not suitable for mass production. Contents of the invention [0004] The technical problem to be solved by the present invention is to solve the problem of camera foam products sticking back and falling off without substrate glue, and to ensure the production feasibility of the invisible shrinkage design method. [0005] The present invention is realized through the following technical proposals: an invisible retraction design metho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/38B26F1/02
CPCB26F1/02B26F1/38
Inventor 刘建锋卢泉水马荣波
Owner SHENZHEN LLMACHINECO LTD