A kind of semiconductor encapsulation mold and its encapsulation process
A packaging process and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of incomplete protection of semiconductor chips, inability to meet the rapid positioning of semiconductor chips of different sizes, etc., to help heat dissipation and improve use. effect of life
Active Publication Date: 2021-07-09
东和半导体设备(南通)有限公司
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Problems solved by technology
[0002] Semiconductor packaging refers to encapsulating and protecting semiconductor chips with protective shells. The existing packaging devices do not provide comprehensive protection for semiconductor chips, and cannot meet the rapid positioning of semiconductor chips of different sizes. Therefore, we propose a semiconductor packaging mold and Its packaging process to solve the problems mentioned in the background technology above
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Embodiment 1
[0024] The present invention provides such Figure 1-4 A semiconductor package mold, comprising a semiconductor chip 11 and a mounting plate 3, the semiconductor chip 11 is arranged in the mounting groove 20 on the upper end of the substrate 13, and fixed by a clamping mechanism in the mounting groove 20, the mounting plate 3 The middle part of the opening groove 7 is provided with an opening groove 7, the upper end of the opening groove 7 is provided with a protective ring 5, the lower end of the mounting plate 3 is provided with a positioning groove 4, and the positioning protrusion 14 on the side of the substrate 13 is snapped into the positioning In the groove 4, pins 9 are connected to the sockets 8 at both ends of the mounting plate 3, and one end of the pins 9 extending into the opening groove 7 is connected to the semiconductor chip 11 through a lead wire 12, and the protective ring 5 There are two sets of transverse support mechanisms 2 connected between the front and...
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The invention discloses a semiconductor packaging mold, which comprises a semiconductor chip and a mounting plate. The semiconductor chip is arranged in a mounting groove on the upper end of a substrate and fixed by a clamping mechanism in the mounting groove. The middle part of the mounting plate is provided with Open slot, the lower end of the mounting plate is provided with a positioning groove, the positioning protrusion on the side of the substrate is snapped into the positioning groove, and pins are connected to the sockets at both ends of the mounting plate, and the pins One end protruding into the opening groove is connected to the semiconductor chip through a wire, and two sets of lateral support mechanisms are connected between the front and rear side walls of the protective ring, and the outer side of the protective ring is covered by a package cover, and the package cover A ring at the lower end is provided with a raised ring integrally formed therewith. The invention satisfies the rapid fixation of semiconductor chips of different sizes, is beneficial to the heat dissipation of the semiconductor chips, improves the service life of the semiconductor chips, and also plays an all-round protection role for the semiconductor chips.
Description
technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a semiconductor packaging mold, and also relates to a packaging process of the semiconductor packaging mold. Background technique [0002] Semiconductor packaging refers to encapsulating and protecting semiconductor chips with protective shells. The existing packaging devices do not provide comprehensive protection for semiconductor chips, and cannot meet the rapid positioning of semiconductor chips of different sizes. Therefore, we propose a semiconductor packaging mold and Its packaging process is to solve the problems mentioned in the above-mentioned background technology. Contents of the invention [0003] The object of the present invention is to provide a semiconductor packaging mold and its packaging process, so as to solve the problems raised in the above-mentioned background technology. [0004] In order to achieve the above object, the present inve...
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IPC IPC(8): H01L21/56
CPCH01L21/565
Inventor 童华
Owner 东和半导体设备(南通)有限公司