Multilayer hollowed-out flexible board uncovering process

Abstract

The invention belongs to a process in the field of FPC (Flexible Printed Circuit) boards. The process comprises the steps of providing a double-sided board, a double-sided board cover film, a pure adhesive film and a copper-clad plate, wherein the double-sided board cover film is provided with a cover film window corresponding to a golden finger or a screen pressing finger; running through the double-sided board cover film, the pure adhesive film, the copper-clad plate and the double-sided board in a double-drilling mode to form an FPC via hole, wherein the FPC via hole enables all layers of circuits to be connected, and thus the normal use of all functions on the FPC is guaranteed; plating copper on the copper-clad plate to form an electroplated layer; etching uncovering lines corresponding to the pure adhesive film window on the copper-clad plate and the electroplated layer, wherein the uncovering lines are mutually enclosed to form a waste material area; and removing the waste material area to expose the circuit of the golden finger pattern or the screen pressing finger pattern on the double-sided board. The problem that the uncovering process in the prior art does not correspondingly design the flexible board is solved, the process is simplified, and the environmental damage is further improved.

Description

technical field [0001] The invention relates to the field of FPC circuit boards, in particular to a cover-opening process. Background technique [0002] After searching, it is found that FPC circuit board is a kind of flexible circuit board, which has the characteristics of free bending, folding, winding, small volume, thinness, random movement and expansion and contraction, etc. Therefore, FPC circuit board is widely used in the range of electronic products. Roughly the circuit system in refrigerators and air conditioners, and as small as the circuit modules in mobile phones and connectors. [0003] The existing multi-layer hollow flexible board takes into account the flexibility of the body and the wiring density of the component area. In the design process of the multi-layer hollow flexible board, the wiring design of 3-6 layers in the component area and 1-2 layers in the bending area is often used. This design method is similar to the design of the flex-rigid board, but...

AI Technical Summary

Problems solved by technology

[0003] The existing multi-layer hollow flexible board takes into account the flexibility of the body and the wiring density of the component area. In the design process of the multi-layer hollow flexible board, the wiring design of 3-6 layers in the component area and 1-2 layers in the bending area is often used. This design method is similar to the design of the flex-rigid board, but it is inconsistent with the flex-rigid board: the multi-layer area is made of pure soft board material instead of hard board material, so the FPC has a large impact on the bending area during the production process. The protection is inconsistent with the soft-rigid board, and the production process of the soft-hard board cannot be used for design and manufacture. It is necessary to design and match the manufacturing process of the soft board.

Images