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A device for eliminating tin tumors and its application method

A mold sleeve and sleeve technology, applied in auxiliary devices, welding equipment, superconducting devices, etc., can solve the problems of low yield of WIC superconducting wire, serious tin nodules on the surface of the wire, and inability to use it normally, so as to eliminate tin Tumor defects, improved surface quality, wide applicability effects

Active Publication Date: 2021-05-14
西部超导材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to achieve the purpose of inlaid welding in the prior art, a fixed mold device is required. The process of the fixed mold device will lead to serious tin tumors on the surface of the wire, which cannot be used normally, resulting in low yield and high cost of WIC superconducting wire. , the present invention provides a device for eliminating tin tumors, which greatly reduces the outflow of tin liquid in the process of setting the mold by using titanium alloy sleeves during the preparation of inlaid wires, and the small amount of tin liquid that flows out is avoided due to the diversion of the sleeves. Streamline the surface of the wire, completely eliminate the tin bump defect of the inlaid wire, improve the surface quality of the inlaid wire, and have wide applicability in the field of superconducting wire processing

Method used

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  • A device for eliminating tin tumors and its application method
  • A device for eliminating tin tumors and its application method
  • A device for eliminating tin tumors and its application method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Embodiment 1: The device for eliminating tin tumors of the present invention

[0036] As attached to the manual Figure 1-4 As shown, the present invention provides a device for eliminating tin warts, said device comprising a sleeve 2 and a mold cover 1, the end of the sleeve 2 is provided with an external thread 3, the mold cover 1 is a bottomed cylinder, and the bottom of the mold cover 5. An internal thread 4 compatible with the external thread 3 of the casing 2 is provided at the middle position, and the die sleeve 1 is interference-fitted with the superconducting wire inlaid welding die.

[0037] In the present invention, both the casing 2 and the mold case 1 are made of titanium alloy.

[0038] In the present invention, the internal thread 4 at the middle part of the bottom 5 of the die sleeve and the external thread 3 at one end of the casing 2 have the same length.

[0039] In the present invention, the inner diameter of the casing 2 is 2-7 times the width of ...

Embodiment 2

[0042] Embodiment 2: The use method of the device for eliminating tin tumor of the present invention

[0043] The present invention also provides a method for using the device for eliminating tin tumors, comprising the following steps:

[0044] (1) The mold case 1 is interference-fitted with the superconducting wire inlaid welding mold, and the casing 2 and the mold case 1 are connected through threads.

[0045] (2) Cooperate with the device connected in step (1) and the mold base and install it in the mosaic equipment.

[0046] (3) The superconducting wire 7 and the Cu slot wire 8 are mounted on the pay-off frame.

[0047] (4) The superconducting wire 7 and the Cu groove line 8 are ultrasonically cleaned and soldered respectively, and the tension machine is turned on, so that the clean superconducting wire 7 is embedded in the Cu groove line 8 to pass through the tin liquid and the rectangular mold at a stable and uniform speed, and eliminate tin tumors casing.

[0048] (5...

Embodiment 3

[0051] Embodiment 3: Application of the device for eliminating tin tumors of the present invention

[0052]Take 6000m of NbTi / Cu superconducting wire with a diameter of Φ0.5-Φ0.9mm and a small copper ratio, and 6000m of Cu groove line; the mold and the mold sleeve are over-win-fitted, and the sleeve is connected. The device is matched with the mold base and installed on the inlay equipment Middle; the NbTi / Cu superconducting wire with small copper ratio and the Cu grooved wire are installed on the pay-off frame; the NbTi / Cu superconducting wire and Cu grooved wire with small copper ratio are ultrasonically cleaned, fluxed, and the tension machine is turned on to make the clean small Copper-ratio NbTi / Cu superconducting wires are embedded in Cu grooves and run through tin liquid, rectangular molds and tin tumor-eliminating sleeves at a steady and uniform speed; cooling the embedded wires; Wound on the take-up reel to complete the WIC inlaid wire.

[0053] During the die-fixing...

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Abstract

The invention provides a device for eliminating tin nodules. The device includes a sleeve and a mold sleeve. The end of the sleeve is provided with an external thread, the mold sleeve is in the shape of a bottomed cylinder, and the middle position of the bottom of the mold sleeve is provided with and outside the sleeve. The internal thread is suitable for the thread, and the die sleeve and the superconducting wire inlaid welding die have an interference fit. The invention makes the mold and the mold sleeve interference fit by processing the mold sleeve, and through the design of the sleeve, the outflow of the tin liquid in the process of over-fixing the mold is greatly reduced in the process of preparing the inlaid wire, and a small amount of the tin liquid flowing out is due to the guide of the sleeve. The flow action avoids the flow on the surface of the wire rod, completely eliminates the defect of tin nodules of the inlaid wire rod, improves the surface quality of the inlaid wire rod, and has wide applicability in the field of superconducting wire processing.

Description

technical field [0001] The invention belongs to the technical field of superconducting material processing, and relates to a device and a method for eliminating tin bumps on the surface of inlaid wire rods. Background technique [0002] Magnetic resonance imaging (MRI) technology is a biomagnetic nuclear spin imaging technology developed rapidly with the development of computer technology, electronic circuit technology and superconductor technology. Compared with the X-ray technology based on CT (Computed X-ray Tomography), it has many advantages, such as no radiation damage to the human body, and it can perform rapid imaging of multiple parts, multi-parameters, and multi-functions of the human body. Therefore, MRI has become a One of the indispensable means of modern medical imaging diagnosis. The core component of the magnetic resonance imaging system, the background field magnet system, is made of NbTi / Cu superconducting wires. The application of superconducting wires gr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/00B23K3/08H01B12/04H01B13/00
CPCB23K1/0008B23K3/08H01B12/04H01B13/00
Inventor 张平祥昝琼郭强柳祥蔡晓磊周安林王航空刘建伟李建峰刘向宏冯勇
Owner 西部超导材料科技股份有限公司