A double conduction type silicon carbide photoconductive switch and its preparation method
A photoconductive switch, silicon carbide technology, applied in semiconductor devices, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of unutilized primary energy storage, low energy utilization rate, etc., and achieve increased trigger frequency and full release. Effect
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Embodiment 1
[0039] A dual conduction silicon carbide photoconductive switch, such as figure 1 with figure 2 As shown, a silicon carbide substrate 1 is included, electrodes 3 are arranged on both sides of the upper surface of the silicon carbide substrate 1, and a highly doped n-type gallium nitride layer 2 is arranged between the electrode 3 and the silicon carbide substrate 1, In addition, one of a p-type gallium nitride layer, an n-type silicon carbide layer, and a p-type silicon carbide layer can also be arranged between the electrode 3 and the silicon carbide substrate 1; moreover, between the electrode 3 and the silicon carbide substrate 1 Ohmic contacts can also be formed by ion implantation or high temperature annealing.
[0040] The current channel area between the electrodes 3 is provided with patterned and etched graphics; when the laser triggers the double-conduction silicon carbide photoconductive switch, the photogenerated carriers make the photoconductive switch work in a ...
Embodiment 2
[0048] According to the dual conduction silicon carbide photoconductive switch provided in Embodiment 1, the difference lies in:
[0049] In this example, if image 3 As shown, the patterned etching pattern provided on the current channel area is a periodically arranged square array pattern 5 .
Embodiment 3
[0051] The preparation method of the dual conduction type silicon carbide photoconductive switch provided in embodiment 1 includes:
[0052] (1) Using metal-organic chemical vapor deposition (MOCVD) technology to epitaxially grow a 200nm-thick n-type gallium nitride layer of highly doped silicon on the silicon surface of the semi-insulating silicon carbide substrate 1, with a doping concentration of 2×10 19 cm-3, and use the photolithography process to make the electrode pattern of the photoconductive switch on the silicon carbide substrate 1; the distance between the electrodes 3 is 1-7mm, and the size of the electrodes 3 is (3-5)mm×(6 -10) mm;
[0053] (2) Evaporating a Ti / Pt / Au composite metal layer on the semi-insulating silicon carbide substrate 1 by using electron beam evaporation equipment, and peeling off with acetone to obtain a whole silicon carbide wafer with a photoconductive switch electrode structure;
[0054] (3) The samples were alloyed in an alloy furnace wit...
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