Lamination device for high-frequency mixing-pressure plates with layer number convenient to adjust

Abstract

The invention belongs to the technical field of auxiliary devices for mixing-pressure plates, and particularly relates to a lamination device for high-frequency mixing-pressure plates with the layer number convenient to adjust. The device comprises a shell, an inner bin, a cold bin, an air bin and a driving plate, the inner bin is integrally connected into the shell, and the cold bin is fixedly connected to the bottom of the shell through bolts; the air bin is fixedly connected to the bottom of the cold bin through bolts. According to the lamination device for the high-frequency mixing-pressure plates with the layer number convenient to adjust, through combined application of parts, a fence with a cavity environment can be formed in the shell through combination of supports and partition plates, the high-frequency mixing-pressure plates are conveniently placed inside, and the lamination adjustment aim is achieved. In cooperation with the air bin of the bottom, in the process of generating wind power, a refrigerant bin makes the interior of a circulation pipe achieve continuous refrigerant circulation through a circulation pump, after the wind temperature is lowered, wind enters theinner bin through vent holes, in cooperation with a vent plate, the high temperature in the inner bin is lowered, the effect of adjusting the layer number of the high-frequency mixing-pressure platesis conveniently improved, and the service life of the high-frequency mixing-pressure plates is prolonged.

Description

technical field [0001] The invention relates to the technical field of mixed pressure board auxiliary devices, in particular to a high-frequency mixed pressure board stacking device whose number of layers is easy to adjust. Background technique [0002] The rapid development of electronic communication technology is an inevitable process of modernization. In order to achieve high-speed and high-fidelity transmission of signals, more and more high-frequency printed circuit boards are used in communication equipment; the dielectric materials used in high-frequency boards have excellent Electrical properties, good chemical stability, high-frequency boards are widely used in wireless antennas, base station receiving antennas, power amplifiers, components (shunts, combiners, filters), radar systems, navigation systems and other communication equipment. [0003] In the process of using high-frequency mixed pressure boards, based on factors such as cost savings, improvement of bend...

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Problems solved by technology

[0005] The object of the present invention is to provide a high-frequency mixed laminated board stacking device with easy adjustment of the number of layers, so as to solve the problem that the existing mixed laminated boards proposed in the above background technology are divided into composite laminated boards with their own layers and finished mixed laminated boards. In the process of stacking the layers of finished mixed laminates, there is no special device for adjusting the number of layers of high-frequency mixed laminates. It is necessary to solve the problem of external fixation by yourself, which is cumbersome and easy to install outside for a long time. Damage occurs, and the effect on the adjustment of the stacked plates is poor, and during the stacking process of the high-frequency mixed plate, there is a lack of heat dissipation gaps and heat exchange methods. The aging or even damage of the mixed laminated board makes it difficult to guarantee the normal service life in the layer stack of the finished high-frequency mixed laminated board, resulting in economic loss and waste of resources

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