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OCR thin film encapsulation process of a display module

A display module and thin film packaging technology, which is applied in the direction of identification devices, instruments, semiconductor devices, etc., can solve the problems of difficult to meet production needs, low production efficiency, high equipment, etc., to meet production needs, improve packaging effects, and reduce production costs. Effect

Active Publication Date: 2020-09-11
AET DISPLAY LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this packaging method has high requirements on equipment and technology, and the production efficiency is low, so it is difficult to meet the production demand.

Method used

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  • OCR thin film encapsulation process of a display module
  • OCR thin film encapsulation process of a display module
  • OCR thin film encapsulation process of a display module

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0036] The first embodiment provided by the present invention is an OCR film packaging process for a display module, which includes the following steps:

[0037] (1) if figure 1 As shown, a display module 10 is provided, and the display module 10 includes a display substrate 11, a driver IC 12 and an LED chip 13; a plurality of driver ICs 12 are mounted on the bottom surface of the display substrate 11, and a plurality of LED chips 13 are mounted on the display substrate 11 top surface. Wherein, the display substrate 11 is a rigid printed circuit board.

[0038] (2) if figure 2 As shown, an OCR liquid optical glue 20 is provided, and the OCR liquid optical glue 20 is evenly coated on the surface of the display substrate 11 and covers the LED chip 13 . Wherein, the thickness of the OCR liquid optical glue 20 is higher than the height of the LED chip 13; the OCR liquid optical glue 20 is made of acrylic, and is a transparent glue.

[0039] (3) Pre-cure the OCR liquid optica...

no. 2 example

[0043] The second embodiment provided by the present invention is an OCR film packaging process for a display module, which includes the following steps:

[0044] (1) if figure 1 As shown, a display module 10 is provided, and the display module 10 includes a display substrate 11, a driver IC 12 and an LED chip 13; a plurality of driver ICs 12 are mounted on the bottom surface of the display substrate 11, and a plurality of LED chips 13 are mounted on the display substrate 11 top surface. Wherein, the display substrate 11 is a rigid printed circuit board.

[0045] (2) if figure 2 As shown, an OCR liquid optical glue 20 is provided, and the OCR liquid optical glue 20 is evenly coated on the surface of the display substrate 11 and covers the LED chip 13 . Wherein, the thickness of the OCR liquid optical glue 20 is higher than the height of the LED chip 13; the OCR liquid optical glue 20 is made of acrylic, and is a transparent glue.

[0046] (3) Pre-cure the OCR liquid optic...

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Abstract

The invention provides an OCR thin film packaging process for a display module. The process comprises the steps that (1) a display module is provided; (2) an OCR liquid optical adhesive is provided and uniformly coated on the surface of the display substrate to cover an LED chip; (3) the OCR liquid optical adhesive is pre-cured; (4) a light guide film is provided; the bottom surface of the light guide film is attached to the top surface of the OCR liquid optical adhesive; a fixture is used to press down the top surface of the light guide film to bond the bottom surface of the light guide filmto the top surface of the OCR liquid optical adhesive; and (5) the OCR liquid optical adhesive is cured to acquire a single-layer packaged display module. According to the invention, the packaging process is mainly composed of coating and bonding; the steps are few and simple; and the technology of an automatic bonding device is mature, which can achieve high-efficiency packaging, meet productionrequirements, and reduce production cost.

Description

technical field [0001] The invention relates to the technical field of LED display, in particular to an OCR film packaging process of a display module. Background technique [0002] LED displays include small-pitch LED displays, mini LED displays, and micro LED displays. The structure of the LED display is usually that multiple independent display modules are spliced ​​through mechanical components to form a large-sized LED display. [0003] The display module includes a PCB board, a plurality of LED chips mounted in a rectangular array on one side of the PCB board, and IC components arranged on the other side of the PCB board. In order to prevent the LED chip from being directly exposed to the air, easily polluted or artificially damaged, affecting or destroying the function of the chip, it is usually necessary to pot the side of the PCB board where the LED chip is mounted with a layer of epoxy resin, and the epoxy resin will bond the LED chip and The bonding wires are en...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/54G09F9/33
CPCG09F9/33H01L33/005H01L33/54
Inventor 梁文骥许晋彰赵春雷孙明
Owner AET DISPLAY LTD
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