A pcb stack-up high-precision electrical loss test device based on immersion liquid cooling

Abstract

The invention discloses a high-precision electrical loss test device for PCB stacked boards based on immersion liquid cooling, which includes a PCB carrier board, a component under test embedded in the PCB carrier board, and an installation device set on the surface of the PCB carrier board. Groove, laid on the bottom surface of the installation groove and signal transmission board connected with the signal of the component under test, and a signal connector installed on the surface of the PCB carrier board and connected with the tester signal, the signal connector The bottom surface of the signal connector is in close contact with the surface of the PCB carrier board and kept sealed, and the signal pins on the bottom surface of the signal connector are kept in contact with the signal transmission board. The immersion-type liquid-cooled PCB stack-up high-precision electrical loss testing device disclosed by the present invention can avoid the electrical characteristics of the signal connector being affected by changes in the gas-liquid phase test environment, and improve the accuracy of PCB materials in an immersion-type liquid-cooling environment. Accuracy of electrical loss test results.

Description

technical field [0001] The invention relates to the technical field of PCB, in particular to a high-precision electrical loss testing device for PCB laminates based on immersion liquid cooling. Background technique [0002] With the advent of the big data explosion generation such as 5G interconnection and AI technology development, the data transmission volume has grown exponentially. For these large data centers for data computing and storage, the development of high density and high power has become an irresistible trend. However, such a development demand brings about a thorny problem of heat dissipation. The traditional air-cooled system that uses air cooling for heat dissipation gradually fails to meet the design requirements. However, liquid cooling technology has the characteristics of higher efficiency and lower energy consumption, so gradually Stand out and develop along with the trend. [0003] Liquid cooling at this stage is not just a water cooling system. It ...

AI Technical Summary

Problems solved by technology

However, since the electrical characteristics of the signal terminals of the signal connector are generally stable in the air and match the electrical characteristics of the component under test, such as the input impedance and node impedance are generally stable at around 50Ω, however, when the signal connector is immersed in the cooling After being submerged in liquid, the working environment of the signal terminal of the signal connector changes, from the gas phase environment to the liquid phase environment, and the environmental dielectric parameter Dk value changes, which will cause the electrical characteristics of the signal terminal to change, such as impedance deviation from 50Ω etc., resulting in a substantial increase in the system return loss, which in turn affects the accuracy of the electrical loss test results of the tested component

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