Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resistive sensor array test circuit based on two-wire equal-potential method

A technology of resistive sensor and equipotential method, which is applied in the field of sensors, can solve the problems of destroying the ideal isolation feedback condition of the test circuit, the influence of the test accuracy of the resistive sensor array, and the increase of the measurement error of the resistance value of the tested unit, etc., to achieve the expansion of resistance Value range, eliminate the interference of space electromagnetic noise, eliminate the effect of crosstalk error

Inactive Publication Date: 2019-12-31
久耀电子科技(江苏)有限公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Lead resistances with basically the same resistance and contact resistances with different resistances have a significant impact on the test accuracy of the resistive sensor array
As far as the shared row and column resistive sensor array based on the equipotential method is concerned, the lead resistance and contact resistance lead to the potential difference between the test circuit driving terminal and the resistive sensor array module driving terminal, and also cause the test circuit sampling terminal to resist. The potential difference between the sampling terminals of the sensor array module destroys the ideal isolation feedback condition of the test circuit and increases the resistance measurement error of the unit under test.
Therefore, basically the same connection cable lead resistance and different cable joint contact resistance have a significant impact on the test results of the shared row and column resistive sensor array based on the equipotential method. Affects the measurement error of the unit under test, how to eliminate the influence of these factors is a problem that needs further study

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resistive sensor array test circuit based on two-wire equal-potential method
  • Resistive sensor array test circuit based on two-wire equal-potential method
  • Resistive sensor array test circuit based on two-wire equal-potential method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The technical scheme of the present invention is described in detail below in conjunction with accompanying drawing:

[0031] The principle of the equipotential method test circuit for the shared row and column line resistive sensor array is as follows: figure 2 as shown, image 3 It is the equivalent diagram of the test principle, the current unit under test in the diagram R xy for M x N shared row and column resistive sensor array R 11 . In this circuit, there is only one connection between each row or column line of the array and the test circuit. Under the ideal working condition of the circuit, the channel on-resistance of all the two-to-one multi-way switches of the column lines R sc , the cumulative resistance of the lead resistance of the drive connection line and the contact resistance of the connector R Lc is ignored like this R xy The voltage of the column line V cy =V xy , the voltage of the other column lines is 0; at the same time, the cu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a resistive sensor array test circuit based on a two-wire equal-potential method, and belongs to the technical field of sensors. The test circuit is directed to an M*N two-dimensional resistive sensor array that shares row and column lines, and comprises a current feedback operational amplifier, N column line drive operational amplifiers, an equal current one-in-M multi-wayswitch, an equal potential one-in-M multi-way switch, N column line one-in-two multi-way switches, a test current setting resistor, a reference voltage source, and two connection lines set for each row and column lines of the resistive sensor array. The invention also discloses a test method of the test circuit and a sensing system. Compared with the prior art, the invention, by adopting the two-wire equal-potential method as the key technology, can effectively eliminate measurement errors caused by connecting the cable lead resistor, the cable connector contact resistor and the multi-way switch channel on-resistor, and greatly improve the measurement accuracy of the resistive sensor array.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a resistive sensor array testing circuit. Background technique [0002] The array sensing device is to combine multiple sensing elements with the same performance according to the structure of a two-dimensional array. It can change or generate corresponding shapes and characteristics by detecting changes in parameters focused on the array. This feature is widely used in biosensing, temperature tactile and thermal imaging based on infrared sensors, etc. [0003] Resistive sensor arrays are widely used in infrared imaging simulation systems, force tactile sensing and temperature tactile sensing. Taking temperature touch as an example, since the temperature sensing device involves the transfer of heat and the perception of temperature, in order to obtain the thermal properties of the object, the device puts forward higher requirements for the temperature measurement accuracy and re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01D5/16
CPCG01D5/16
Inventor 赵莉民
Owner 久耀电子科技(江苏)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products