Substrate processing apparatus, storage medium and substrate processing method

A technology of substrate processing equipment and processing methods, which is applied in the direction of metal material coating technology, program control, instruments, etc., and can solve problems such as the influence of processing results

Active Publication Date: 2019-12-31
ASM IP HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, effects that are completed in a shorter period of time after the start of subsequent processing will have an impact on the processing results

Method used

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  • Substrate processing apparatus, storage medium and substrate processing method
  • Substrate processing apparatus, storage medium and substrate processing method
  • Substrate processing apparatus, storage medium and substrate processing method

Examples

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Embodiment Construction

[0015] A substrate processing apparatus, a storage medium, and a substrate processing method according to some examples will be described with reference to the accompanying drawings. The same or corresponding constituent elements are denoted by the same reference numerals, and repeated descriptions thereof will be omitted.

[0016] figure 1 is a diagram showing an example of the configuration of a substrate processing apparatus. figure 1 The substrate processing equipment of can be, for example, equipment for forming a film on a substrate. The substrate processing apparatus includes a controller 10 . The controller 10 is, for example, a unique platform controller (UPC). The controller 10 is a portion for executing a schedule of substrate processing, executing an instruction of substrate processing, and the like. The controller 10 includes a storage medium 10a and a computer 10b. The storage medium 10a stores therein, for example, data on the configuration of the substrate...

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Abstract

Examples of a substrate processing apparatus includes a device for subjecting a substrate to processing, and a controller for modifying a control parameter predetermined to control the device with a first modification value and a second modification value that vary over time, thereby calculating a modified parameter, and controlling the device based on the modified parameter, wherein the first modification value has a shorter term for modifying the control parameter than the second modification value.

Description

technical field [0001] Examples related to substrate processing apparatuses, storage media, and substrate processing methods are described. Background technique [0002] JP6,119,400B discloses to adjust the parameters of the method based on the information of the film thickness so that the film thickness is always constant with respect to the subsequent film forming process. US 7,313,450B discloses a system for feeding information from measuring instruments back to equipment to automatically change methods. [0003] In a variant of the method based on the measurement information disclosed in JP6,119,400B and US7,313,450B, the method can be changed so as not to be affected by the cleaning and pre-coating or waiting time taking place in the chamber. As a result, effects that are done in a shorter period of time after the start of subsequent processing will have an impact on the processing result. Contents of the invention [0004] Some of the examples described in this art...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCH01L22/26H01L22/12C23C16/52C23C16/45525G05B19/41875H01L21/67276H01L21/67253G05B2219/23103G05B2219/23101G05B2219/2602G05B2219/45032
Inventor 和田隆野口哲安達渉村松大輔
Owner ASM IP HLDG BV
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