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semiconductor package

A semiconductor and packaging technology, applied in the field of semiconductor packaging

Active Publication Date: 2021-12-14
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Bottleneck in effectively dissipating the heat generated in the internal die of a semiconductor package

Method used

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Embodiment Construction

[0017] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, in the following description, forming a first component on or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which an additional component may be formed between the first component and the second component. components so that the first component and the second component may not be in direct contact with each other. In addition, the present invention may repeat reference numerals and / or characters in various embodiments. This repetition is for the sake of simplicity and clarity and does not in itself indicate a rel...

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Abstract

A semiconductor package is provided. One of the semiconductor packages includes a semiconductor die, a thermally conductive pattern, an encapsulant, and a thermally conductive layer. A thermally conductive pattern is disposed next to the semiconductor die. The encapsulant seals the semiconductor die and the thermally conductive pattern. A thermally conductive layer covers the rear surface of the semiconductor die, wherein the thermally conductive pattern is thermally coupled to and electrically insulated from the semiconductor die through the thermally conductive layer.

Description

technical field [0001] Embodiments of the present application relate to semiconductor packages. Background technique [0002] In the packaging of integrated circuits, a semiconductor die may be encapsulated by a molding compound and bonded to other packaging components, such as an interposer and a packaging substrate. Heat dissipation is a challenge in semiconductor packaging. There is a bottleneck in effectively dissipating the heat generated in the internal die of the semiconductor package. Contents of the invention [0003] An embodiment of the present application provides a semiconductor package, including: a semiconductor die; a heat conduction pattern positioned next to the semiconductor die; an encapsulant that seals the semiconductor die and the heat conduction pattern; and a heat conduction layer covering the The rear surface of the semiconductor die, wherein the thermally conductive pattern is thermally coupled to and electrically insulated from the semiconduct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/367
CPCH01L23/3114H01L23/367H01L23/3677H01L23/49811H01L23/5389H01L23/49827H01L2224/18H01L21/6835H01L2221/68345H01L2221/68359H01L21/561H01L23/3128H01L21/4857H01L21/486H01L25/105H01L2225/1035H01L2225/1058H01L2225/1094H01L24/19H01L24/20H01L2224/24155H01L2224/96H01L2224/19H01L23/31H01L25/0657H01L23/481H01L23/525H01L23/4334H01L2225/1041H01L24/24H01L24/25H01L23/3675H01L25/18H01L23/3121H01L23/3135H01L2224/24175H01L2224/25171H01L2224/82005H01L21/568
Inventor 林俊成卢思维
Owner TAIWAN SEMICON MFG CO LTD