Supercharge Your Innovation With Domain-Expert AI Agents!

SMT Solder paste printing method based on thin packaging substrate

A packaging substrate and solder paste printing technology, which is applied in the field of substrate printing, can solve the problems of thin packaging substrates that are prone to poor molding, and achieve the effect of improving the printing yield and printing quality

Active Publication Date: 2020-01-24
DONGGUAN RAMAXEL MEMORY TECH LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to address the above technical problems and provide an SMT solder paste printing method that can solve the problem of poor molding of thin packaging substrates during the solder paste printing process.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • SMT Solder paste printing method based on thin packaging substrate
  • SMT Solder paste printing method based on thin packaging substrate
  • SMT Solder paste printing method based on thin packaging substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention, and similar component numbers in the drawings represent similar components.

[0028] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude one or Presence or addition of multiple other features, integers, steps, operations, elements, components and / or collections thereof.

[0029] It should also be understood that the terms used in the description of the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present invention. As used in the description of the embodiments of the present invention an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses an SMT solder paste printing method based on a thin packaging substrate. The method comprises the following steps: dividing the thin packaging substrate into a functional region and a non-functional region according to the layout of the thin packaging substrate before solder paste printing; thinning the non-functional region of the thin packaging substrate to form a thinnedregion; designing matching corresponding magnetic steel sheets according to the layout of the thinned region; fixing the magnetic steel sheets in the corresponding thinned region so that the printingsurface formed by the thin packaging substrate is a flat surface; and performing solder paste printing through common printing steel screen. The problem that the thin packaging substrate is liable tohave poor formation in the solder paste printing process can be solved and the printing yield of the thin printed substrate can be improved.

Description

technical field [0001] The invention relates to the technical field of substrate printing, in particular to an SMT solder paste printing method based on a thin packaging substrate. Background technique [0002] SMT (Surface Mounted Technology) surface mount technology is currently the most popular technology and process in the electronics assembly industry. Its main process includes: printing (or dispensing) --> mounting --> (curing) --> reflow soldering --> cleaning --> testing --> repair. Among them, the function of printing is to print the solder paste or patch adhesive onto the pad of the PCB to prepare for the soldering of components. The equipment used is a printing machine (solder paste printing machine), which is located at the forefront of the SMT production line. [0003] In the traditional SMT solder paste printing process, for substrates with a thickness greater than 0.15mm, such as figure 1 As shown, since the deformation and warpage of the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/48H05K3/34
CPCH01L21/4867H05K3/34
Inventor 喻志刚
Owner DONGGUAN RAMAXEL MEMORY TECH LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com