A semiconductor light-shielding film die-cutting mechanism
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A semiconductor and film technology, applied in the field of die-cutting mechanism, can solve the problems of unqualified finished products, improper operation, raw material deviation, etc., and achieve the effect of improving precision, preventing manual collection troubles, and avoiding falling and losing
Inactive Publication Date: 2021-04-13
徐州协盈电子科技有限公司
View PDF11 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0003] The semiconductor light-shielding film needs to be fixed during the die-cutting process. Because the surface of the film itself is relatively smooth, it is easy to mishandle the raw material during the die-cutting process and cause the raw material to shift, resulting in the processed finished product being unqualified.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0022] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0023] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0024] In the description of the present invention, it should be understood that the orientations or positional relationships indicated by the terms "upper", "...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
The invention discloses a semiconductor light-shielding film die-cutting mechanism, comprising a base plate shell, a first electric push rod, a first rotating motor, a fixing slot, a second electric push rod, a crawler, a limit plate, a fixed support shell, a first connection block, first slider, telescopic connecting rod, second connecting block, second slider, roller, support rod, second rotating motor, die-cutting roller, rotating connecting shaft, gear, air diffuser, fan, collection box and collection tank. The beneficial effects of the present invention are: the device compresses and fixes the light-shielding film to be processed through the fixed pressure groove structure, and can press and fix the light-shielding film of different lengths by adjusting the distance between the fixed pressure groove structures. It is tightly fixed while preventing the offset and folding of the shading film during processing, which improves the processing accuracy.
Description
technical field [0001] The invention relates to a die-cutting mechanism, in particular to a semiconductor light-shielding film die-cutting mechanism, which belongs to the application technical field of the light-shielding film die-cutting mechanism. Background technique [0002] The die-cutting mechanism is mainly used for die-cutting (full cut, half-cut), indentation and bronzing operations, lamination, automatic For waste discharge, the die-cutting machine uses steel knives, metal molds, steel wires (or templates carved from steel plates), and applies a certain pressure through the embossing plate to roll and cut the printed matter or cardboard into a certain shape. It is an important equipment for post-press packaging processing and molding. [0003] The semiconductor light-shielding film needs to be fixed during the die-cutting process. Because the surface of the film itself is relatively smooth, it is easy to mishandle during the die-cutting process and cause the raw m...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more 
Login to view more