A semiconductor light-shielding film die-cutting mechanism

Abstract

The invention discloses a semiconductor light-shielding film die-cutting mechanism, comprising a base plate shell, a first electric push rod, a first rotating motor, a fixing slot, a second electric push rod, a crawler, a limit plate, a fixed support shell, a first connection block, first slider, telescopic connecting rod, second connecting block, second slider, roller, support rod, second rotating motor, die-cutting roller, rotating connecting shaft, gear, air diffuser, fan, collection box and collection tank. The beneficial effects of the present invention are: the device compresses and fixes the light-shielding film to be processed through the fixed pressure groove structure, and can press and fix the light-shielding film of different lengths by adjusting the distance between the fixed pressure groove structures. It is tightly fixed while preventing the offset and folding of the shading film during processing, which improves the processing accuracy.

Description

technical field [0001] The invention relates to a die-cutting mechanism, in particular to a semiconductor light-shielding film die-cutting mechanism, which belongs to the application technical field of the light-shielding film die-cutting mechanism. Background technique [0002] The die-cutting mechanism is mainly used for die-cutting (full cut, half-cut), indentation and bronzing operations, lamination, automatic For waste discharge, the die-cutting machine uses steel knives, metal molds, steel wires (or templates carved from steel plates), and applies a certain pressure through the embossing plate to roll and cut the printed matter or cardboard into a certain shape. It is an important equipment for post-press packaging processing and molding. [0003] The semiconductor light-shielding film needs to be fixed during the die-cutting process. Because the surface of the film itself is relatively smooth, it is easy to mishandle during the die-cutting process and cause the raw m...

AI Technical Summary

Problems solved by technology

[0003] The semiconductor light-shielding film needs to be fixed during the die-cutting process. Because the surface of the film itself is relatively smooth, it is easy to mishandle the raw material during the die-cutting process and cause the raw material to shift, resulting in the processed finished product being unqualified.

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