A laminated sheet heat dissipation mechanism for transformers
A laminated chip heat dissipation mechanism technology, applied in the direction of transformer/inductor cooling, etc., can solve the problems that the heat dissipation efficiency cannot fully meet the heat dissipation requirements of the transformer, the surface temperature of the transformer cannot be dissipated in time, and the heat dissipation in the gap is slow, etc., to achieve faster Adsorption and conduction, improved heat dissipation effect, accelerated transfer effect
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[0044] see also Figure 1-3 A laminated heat dissipation mechanism for transformer comprises a plurality of evenly distributed heat dissipation scales installed at the outer end of transformer, and an interlayer heat exchange mechanism is installed between two adjacent heat dissipation scales. The interlayer heat exchange mechanism comprises a bottom plate 4 and a laminated heat conduction pipe 1, the bottom plate 4 is fixedly connected with the outer wall of transformer, the left and right outer ends of the laminated heat conduction pipe 1 are fixedly connected with a plurality of heat conduction wires 3, the outer ends of the heat dissipation scales are sleeved with a heat transfer net 2, and the end of the heat transfer net 2 close to the transformer is connected with the bottom plate 4.
[0045] see also Figure 4The laminated heat pipe 1 includes a hollow heat pipe 11, the inside of which is filled with a solid heat conductor, which can be one or two of sand and heat-conducting...
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