Mounting structure for mobile phone mainboard

A technology for installation structure and mainboard, which is applied in the direction of telephone structure, telephone communication, electrical components, etc., can solve the problems of inability to assist heat dissipation, inconvenient disassembly and assembly of the mainboard, etc., and achieve the effect of reducing electromagnetic interference and improving heat dissipation efficiency.

Pending Publication Date: 2020-02-11
江苏尚芯电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When installing the mobile phone motherboard, installation accessories are required, and the existing installation structure is inconvenient to disassemble and assemble the motherboard, and cannot perform auxiliary heat dissipation. Therefore, we propose a mobile phone motherboard installation structure

Method used

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  • Mounting structure for mobile phone mainboard
  • Mounting structure for mobile phone mainboard
  • Mounting structure for mobile phone mainboard

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Embodiment Construction

[0018] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below in conjunction with specific embodiments.

[0019] Such as Figure 1-3 As shown, a mobile phone main board installation structure, including a mounting frame main body 1, a micro fan 8 and a partition 5, a groove 2 is provided on one side of the mounting frame main body 1, and a groove 2 is installed on the inside of the groove 2 by a screw. No. 1 spring 3, and one end of the No. 1 spring 3 is connected to the block 4. The inner lower end of the main body 1 of the installation frame is provided with a support rod 15. One end of the support rod 15 is connected to the micro fan 8. The bottom of the support rod 15 is provided with a No. 2 Spring 9, and the bottom end of No. 2 spring 9 is connected to a heat-conducting silicone grease sheet 10, one side of the main body of the installation fra...

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Abstract

The invention discloses a mounting structure for a mobile phone mainboard. The mounting structure comprises a mounting rack body, a micro fan and partition plates,; a groove is formed in one side in the mounting rack body; a first spring is installed on the inner side of the groove through screws. One end of the first spring is connected with a clamping block; a supporting rod is arranged at the lower end of the inner side of the mounting rack body; one end of the supporting rod is connected with the micro fan, a second spring is arranged at the bottom of the supporting rod, the bottom end ofthe second spring is connected with a heat conduction silicone grease sheet, a through anti-interference magnetic ring is arranged on one side of the mounting rack body, and a humidity switch is mounted on the other side of the mounting rack body through a mounting groove. The mainboard is convenient to mount and dismount, and the mounting structure is good in heat dissipation performance, convenient to use and suitable for being widely popularized and used.

Description

technical field [0001] The present invention relates to the technical field of mobile phone motherboards, in particular to a mounting structure for a mobile phone motherboard. Background technique [0002] When installing the mobile phone motherboard, installation accessories are required, and the existing installation structure is inconvenient to disassemble and assemble the motherboard, and cannot perform auxiliary heat dissipation. Therefore, we propose a mobile phone motherboard installation structure. Contents of the invention [0003] The main purpose of the present invention is to provide a mounting structure for the motherboard of a mobile phone. By setting the No. 1 spring and the block, one end of the motherboard can be inserted into the block and one side can be pushed inward, and then the other end of the motherboard can be inserted into the limit block. At the bottom, the No. 1 spring pushes the block to fix the main board, and pushes the block to take out the...

Claims

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Application Information

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IPC IPC(8): H04M1/02
CPCH04M1/026H04M1/0277
Inventor 连泽伟
Owner 江苏尚芯电子科技有限公司
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