Environment-friendly carborundum wire cutting fluid

Abstract

The invention discloses an environment-friendly carborundum wire cutting fluid. Raw materials of the wire cutting fluid comprise the following components by the weight percentage: 3-5% of a multi-branched chain alcohol modified surfactant, 3-5% of dodecynediol polyoxyethylene ether, 0.5-1% of a hyperbranched Gemini cationic surfactant, 5-15% of a special type of alcohol ether, 3-5% of isostearic acid, 3-5% of AMP-95 and the balance being deionized water added to make the total amount of 100%. The wire cutting fluid has excellent wetting, cooling, lubricating, cleaning, low-foaming and settlingproperties, and has good wetting and permeating properties; the cutting fluid has good antibacterial property, so deterioration of the cutting fluid is prevented, the cutting fluid can be recycled, the cyclic utilization rate is high, and the service life of the cutting fluid is effectively prolonged. The cutting fluid can effectively prevent TTV large and line marks on the surface of a silicon wafer and brittle cracking or scratching of the silicon wafer in the cutting process, improve the smoothness of the surface of the silicon wafer, avoid warping of the silicon wafer, enable the thickness of the processed silicon wafer to be uniform and consistent, and improve the yield.

Description

technical field [0001] The invention relates to the field of cutting fluid, in particular to an environment-friendly diamond wire cutting fluid. Background technique [0002] The diamond coated on the outer layer of the sand wire and the silicon wafer are used to frictionally cut the silicon wafer instead of the traditional steel wire to cut the silicon wafer. The cutting speed is 2 to 3 times that of the steel wire in the mortar cutting process. The required cutting fluid does not require a mortar in which silicon carbide particles are suspended, nor does it need to be mixed with silicon carbide blades in the solution, and its production rate is higher than that of the mortar cutting method, and its consumption of water and electricity is 60% lower than that of the mortar cutting technology. The silicon powder produced after cutting can be fully recycled and reused, which greatly improves the utilization rate of resources, and the depreciation of equipment per unit producti...

AI Technical Summary

Problems solved by technology

However, the addition of silicone defoamer will greatly reduce the storage stability of the cutting fluid on the one hand, and the silicone defoamer is easy to separate out and stratify; on the other hand, it will stick to the surface of the silicon wafer, forming white spots that are not easy to clean, affecting Photoelectric conversion efficiency of solar cells

In addition, in the diamond sand wire cutting process, the diamond coated on the outer layer of the sand wire and t

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