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Light emitting diode package

A technology of light-emitting diodes and packages, which is applied in the direction of electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of light loss, increase in housing size, and disconnection of the electrical connection of Zener diodes, etc., to achieve miniaturization, Improve stability and reduce the effect of physical impact

Pending Publication Date: 2020-03-17
SEOUL SEMICONDUCTOR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the zener diode is arranged in a state exposed to the package, part of the light emitted from the light emitting diode is absorbed by the zener diode, so there is a problem that light loss occurs accordingly.
[0005] Also, in the case where the Zener diode is arranged in the case of the light emitting diode package, there is a problem that the size of the case becomes large.
Also, the case is formed by injection molding or the like, and in the process of forming the case in this way, there is a problem that the electrical connection of the Zener diode is disconnected, etc.

Method used

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  • Light emitting diode package
  • Light emitting diode package
  • Light emitting diode package

Examples

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Embodiment Construction

[0053] Preferred embodiments of the present invention will be described more specifically with reference to the drawings.

[0054] figure 1 is a perspective view illustrating a light emitting diode package according to a first embodiment of the present invention. and, figure 2 is a plan view illustrating a light emitting diode package according to a first embodiment of the present invention. image 3 is along figure 2 The section view taken by the interception line II'.

[0055] refer to Figure 1 to Figure 3 , the light emitting diode package 100 according to the first embodiment of the present invention includes a case 110 , a light emitting diode chip 120 , a lead frame 130 and a Zener diode 140 .

[0056] In this embodiment, the housing 110 includes a main body 111 , a cover 113 and a coating part 115 .

[0057] As shown in the drawing, the body part 111 may have a substantially quadrangular shape in plan, and may have a shape wrapping the lead frame 130 to support...

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PUM

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Abstract

The invention discloses a light emitting diode package. A light emitting diode package according to one embodiment of the present invention comprises: a housing including a body part; a first lead; asecond lead; a light emitting diode chip; and a Zener diode. The body part has a cavity that is open at the top and has inclined side surfaces. The first lead and the second lead are supported by thehousing and are disposed apart from each other so as to be electrically insulated. The light emitting diode chip is electrically connected to the first lead and the second lead and mounted within thecavity of the body part. The Zener diode is mounted on one side of the light emitting diode chip and inside the cavity of the body part. Here, the body part is configured such that among the inclinedsurfaces surrounding the light emitting diode chip, one surface that is adjacent to the Zener diode is a different inclined surface from the other surfaces. According to the present invention, an inclined cover part is formed by covering a region of the light emitting diode package, in which the Zener diode is disposed, with a material containing a reflective substance.

Description

technical field [0001] The present invention relates to a light emitting diode package, and more particularly to a light emitting diode package capable of improving the efficiency of light emitted from the light emitting diode package. Background technique [0002] A light emitting diode is an inorganic semiconductor element that emits light generated by recombination of electrons and holes. Recently, light emitting diodes are utilized in various fields such as display devices, lamps for vehicles, general lighting, and the like. Compared to existing light sources, light emitting diodes have advantages of long life, low power consumption, and fast response speed, and due to these advantages, are rapidly replacing existing light sources. [0003] Such a light emitting diode is manufactured as a package, and a Zener diode may be mounted inside the package. In the prior art, such Zener diodes are arranged in a state of being exposed to the light emitting diode package, or arra...

Claims

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Application Information

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IPC IPC(8): H01L25/16H01L33/48H01L33/60H01L33/62H01L33/64
CPCH01L25/167H01L33/48H01L33/62H01L33/60H01L33/647H01L33/486H01L33/20H01L33/46H01L33/483H01L33/502
Inventor 金柄成朴仁圭宋俊命
Owner SEOUL SEMICONDUCTOR