Unlock instant, AI-driven research and patent intelligence for your innovation.

Head pasting device and reinforcing pasting equipment

A technology of attaching heads and mounting boards, applied in secondary processing of printed circuits, electrical components, laminated printed circuit boards, etc., can solve the problems of damage to electronic components and the inability to monitor the pressure of attaching heads, so as to avoid damage and be accurate. fit effect

Pending Publication Date: 2020-03-24
SHENZHEN XINZHONGDA AUTOMATION TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the current FPC reinforcement lamination equipment in the industry cannot monitor the pressure, and cannot achieve accurate lamination according to the size of the electronic components, while avoiding damage to the electronic components.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Head pasting device and reinforcing pasting equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0024] In the present invention, unless stated otherwise, the orientation words used such as "up, down, left, right" usually refer to the upper, lower, left, and right in the drawings, and "inner, outer" refers to Inside and outside relative to the outline of the part.

[0025] It should be noted that the terms "first" and "second" in the claims, description and drawings of the present application are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It should be understood that the data so used may be interchanged where appropriate for implementation in sequences other than the described embodiments of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a pasting head device and reinforcing pasting equipment. The reinforcing pasting equipment comprises a material pasting system and a host system connected with the material pasting system, and the material pasting system comprises a pasting head moving assembly and a head pasting device connected with the pasting head moving assembly. The head pasting device comprises a connecting seat, a floating suction head assembly, and a guide assembly, a pressure monitoring assembly and a vacuum air path assembly which are connected with the connecting seat and the floating suction head assembly. The pressure data of the floating suction head assembly is monitored in real time and adjusted in time, so that the pressure between the head pasting device and the electronic component is always kept within a proper pressure range, the head pasting device can be correspondingly adjusted according to the sizes and heights of different electronic components, accurate fitting is realized, and the electronic component can be prevented from being damaged.

Description

technical field [0001] The invention relates to the technical field of automatic bonding of covering films of flexible materials, in particular to a head bonding device and reinforcement bonding equipment. Background technique [0002] In the FPC flexible circuit board manufacturing industry, after the electronic components are pasted on the FPC flexible circuit board, a layer of shielding film needs to be pasted on the electronic component area to protect the electronic components. When laminating the protective shielding film, in order to prevent the pasting head from damaging the pasted components, it is required that the pressure of the pasting head of the FPC reinforcement laminating equipment can be changed according to different product requirements, and at the same time, it can realize The bonding pressure is monitored to ensure that the bonding pressure is within the required pressure range and will not damage the electronic components that have been bonded. [000...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/22
CPCH05K3/0058H05K3/22H05K2203/163
Inventor 胡大治金生辉夏士坤周杨邓彪英李万林
Owner SHENZHEN XINZHONGDA AUTOMATION TECH