Tin soldering device for I-shaped inductor processing

Abstract

The invention discloses a tin soldering device for I-shaped inductor processing. The device comprises a baseplate, wherein four supports are disposed at a fixed interval on the top of the baseplate; alead screw is disposed horizontally and horizontally disposed inside the supports in a rotatable manner; lead screw nuts are disposed at an interval on the lead screw; a supporting table is fixedly disposed on a side end of the lead screw nuts; a lifting air cylinder is disposed at the center of the upper surface of the supporting table; a telescopic end of the lifting air cylinder passes throughthe supporting table downwards and is fixedly connected to a lifting table; and a clamping mechanism is disposed on the lower surface of the lifting table. The device disclosed by the invention has the beneficial effects that tin soaking can be conducted on multiple I-shaped inductors at a time; during material fetching, clamping damage to the I-shaped inductors can be effectively prevented; processing quality and production efficiency are increased; and insufficient soldering caused by decrease of a soldering flux or a tin liquid can be prevented.

Description

technical field [0001] The invention relates to the technical field of induction processing, in particular to a soldering device for H-shaped induction processing. Background technique [0002] At present, in various circuit systems, inductance coils play an extremely important role and have been widely used. During the processing of I-shaped inductance, it is necessary to carry out the processing steps of feeding, winding, presser foot, tin dipping, and casing. I-shaped inductors are dipped in tin by first dipping flux at the connection of the pins, and then dipping in tin liquid, so that the pins of the I-shaped inductors are welded and fixed. [0003] At present, the tin immersion process of I-shaped inductance processing is mainly performed by manual operations alone, which is labor-intensive, low in efficiency, and the quality of tin immersion is difficult to guarantee. Different employees are prone to false soldering when immersing tin, and the welding position is not ...

AI Technical Summary

Problems solved by technology

[0003] At present, the tin immersion process of I-shaped inductance processing is mainly performed by manual operations alone, which is labor-intensive, low in efficiency, and the quality of tin immersion is difficult to guarantee. Different employees are prone to false soldering when immersing tin, and the welding position is not firm. , the pins are easy to fall off, the quality of the solder joints is poor, the position of the solder joints is uneven and the shape is not beautiful, and some existing automatic welding machines have the following technical problems: 1. During the process of picking up the I-shaped inductor, If the clamping force is too large, it is easy to damage the enameled wire wrapped with the I-shaped inductor coil, causing the coil to be pinched or misplaced, resulting in a decrease in the quality of the inductor and an increase in the rate of unqualified products; 2. I-shaped inductors It is easy to drop when loading materials, causing the inductor to fall into the flux tank or tin melting furnace, which not only pollutes and destroys the flux or tin liquid, but also leads to increased production costs and mass production quality problems; 3. With During the tin immersion process, the flux liquid level in the flux tank and the tin liquid level in the tin melting furnace begin to drop, resulting in insufficient tin liquid or flux during soldering, which makes the soldering of the inductance pins weak

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