Communication device

Abstract

The invention discloses communication equipment, and belongs to the technical field of heat dissipation. The communication equipment comprises a machine frame, a controller, a single board and a heatdissipation component, wherein the controller, the single board and the heat dissipation component are arranged in the machine frame. The single board comprises a circuit board, a fixed heat dissipation board, a movable heat dissipation board and a motion control part, the fixed heat dissipation board is fixedly installed at the front end of the circuit board, and the movable heat dissipation board is installed on the fixed heat dissipation board in a sliding mode and is parallel to the fixed heat dissipation board; each of the fixed heat dissipation plate and the movable heat dissipation plate comprises a plurality of heat dissipation holes, when the movable heat dissipation plate slides to a first position, the plurality of heat dissipation holes of the movable heat dissipation plate arealigned with the plurality of heat dissipation holes of the fixed heat dissipation plate, and when the movable heat dissipation plate slides to a second position, the plurality of heat dissipation holes of the movable heat dissipation plate and the plurality of heat dissipation holes of the fixed heat dissipation plate are staggered; a motion control part is installed on the circuit board and used for controlling the movable heat dissipation plate to slide according to instructions of the controller. By adopting the invention, the energy utilization rate can be improved and the energy is saved.

Description

technical field [0001] The present application relates to the technical field of heat dissipation, and in particular to a communication device. Background technique [0002] Communication devices, such as switches, usually consist of a chassis and multiple boards. These single boards may be main control boards, service boards, or switching fabric boards. Slots matching the boards can be set in the chassis, and these boards can be installed in the corresponding slots. Each single board includes multiple devices, such as multiple chips. The devices on the single board will generate a lot of heat when they work. In order to ensure that the heat does not affect the normal operation of the communication equipment, multiple heat dissipation components, such as fans, are installed in the chassis. Each single board also includes a heat dissipation plate for heat dissipation. The board is provided with a plurality of heat dissipation holes, so that the fan can draw cold air outsid...

AI Technical Summary

Problems solved by technology

[0003] When several adjacent boards in a communication device share a heat dissipation component, even if a single board does not need to dissipate heat, the heat dissipation component will also dissipate heat for other adjacent boards, thus causing energy loss waste

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