Ring support structure and ceramic capacitive pressure sensor using it
A pressure sensor and ring support technology, which is applied in the direction of fluid pressure measurement using capacitance changes, can solve the problems of adverse effects on the accuracy of the capacitance sensor assembly, cannot be predicted and compensated, and affect the geometric structure, so as to reduce the accumulation of processing errors and reduce Effect of gas residue and stability improvement
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0020] In view of the prior art, the metal diaphragm and the ceramic electrode due to different material components thermal expansion coefficients lead to mechanical hysteresis, thereby affecting the distance d value between the metal diaphragm and the ceramic electrode.
[0021] The present invention solves the error accumulation caused by the superposition of one or more components d between the distance d value of the metal diaphragm and the ceramic electrode. The present invention proposes a capacitive pressure sensor ceramic electrode ring support structure. The ring support structure is directly processed and formed on the shell parts, directly supporting the ceramic fixed electrode.
[0022]To make the object, technical solution and advantages of the present invention more clearly understood, the following in conjunction with specific embodiments, and with reference to the accompanying drawings, the present invention will be further elaborated in detail.
[0023] Figure 1 ...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com